Mission profile concept for PV modules: use case - middle east deserts vs temperate European climate

被引:0
作者
Jaeckel, Bengt [1 ]
Dassler, David [1 ]
Pander, Matthias [1 ]
John, Jim Joseph [2 ]
Kumar, Sagarika [2 ]
Adothu, Baloji [2 ]
机构
[1] Fraunhofer Ctr Silicon Photovolta CSP, Otto Eissfeldt Str 12, D-06120 Halle, Saale, Germany
[2] DEWA Res & Dev Ctr, POB 564, Dubai, U Arab Emirates
关键词
Mission profile; climate data; degradation; forecast; simulation; CLASSIFICATION; PERFORMANCE;
D O I
10.1051/epjpv/2023030
中图分类号
O59 [应用物理学];
学科分类号
摘要
The paper addresses the need to simplify the comparison between different climatic conditions. Therefore, the concept of Mission Profiles is introduced to PV. Mission Profiles are a set of climatic stresses compiled to allow direct comparisons such as temperature, humidity, and UV exposure. The use-case in this paper is a comparison of a temperate with a hot climate. The results show that temperature driven processes are highly accelerated for the hot climate, whereas processes that involve humidity may lead to a similar annual degradation. The impact of light, particularly UV, is even more complex. UV triggered reaction processes can be photon absorption triggered and accelerated by temperature. However, for most observed interactions and material changes UV light goes in conjunction with moisture (H2O) for the chemical reaction and is accelerated by temperature. Calculating the impact of temperature and UV is possible. However, the impact of moisture is almost impossible as it requires the knowledge of the local microclimate. Only a "worst-case" scenario can be assumed while using ambient relative humidity for most events of the day, that, however, do typically not include condensation. With the introduction of Mission Profiles, it should be possible to assess stress more easily for particular sites in general. Differences in mounting such as open rack compared to e.g., BiPV can also better addressed, however, with some assumption to define the microclimate (e.g., exclude rear side cooling).
引用
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页数:10
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