Characterization of fluorinated poly(aryl ether) with low dielectric constant synthesized by nucleophilic polycondensation

There has been a broad demand for materials with high thermal stability and low dielectric constant in the field of microelectronic devices and communication technology. In this paper, a novel fluorinated poly(aryl ether) (FPAE) was prepared by S(N)2 nucleophilic polycondensation. FPAE was demonstrated to possess a favorable dielectric constant of 2.68 at 1 MHz and its dielectric relaxation behavior at various temperatures and frequencies was analyzed. The resin performed excellent thermal stability and heat resistance, with a 5% mass loss temperature of 514 & DEG;C and a glass transition temperature of 260 & DEG;C. FPAE exhibits high solubility in N, N-dimethyl-formamide, acetone, ethyl acetate and other solvents. Excellent solubility gives FPAE good film formation and processability. The tensile strength and tensile modulus of FPAE were 67.0 MPa and 2.1 GPa, displaying decent mechanical properties. Attributed to the characteristics of the fluorine atoms, FPAE demonstrated a certain hydrophobicity with a water contact angle of 97.9 & DEG;, as well as satisfactory water absorption (0.17%) and a low surface energy of 21.71 J/mm(2). These data indicate that FPAE is expected to be used as low-dielectric material in microelectronics and communication technology.