Observation of Highly Anisotropic Thermal Expansion of Polymer Films

被引:3
作者
Chaikasetsin, Settasit [1 ]
Jung, Jun Young [2 ]
Kim, Hongdeok [3 ,4 ,5 ]
Kim, Brian S. Y. [6 ]
Seo, Jungju [2 ]
Choi, Joonmyung [3 ,5 ]
Bae, Kiho [7 ]
Park, Woosung [8 ]
机构
[1] Stanford Univ, Dept Mech Engn, Stanford, CA 94305 USA
[2] Korea Basic Sci Inst, Sci Instrumentat Assessment & Applicat Team, Daejeon 34133, South Korea
[3] Hanyang Univ, Dept Mech Design Engn, Seoul 04763, South Korea
[4] Hanyang Univ, Dept Mech Engn, Ansan 15588, South Korea
[5] Hanyang Univ, BK21 FOUR ERICA ACE Ctr, Dept Mech Engn, Ansan 15588, South Korea
[6] Columbia Univ, Dept Mech Engn, New York, NY 10027 USA
[7] Korea Inst Energy Technol, Dept Energy Engn, Naju 58217, South Korea
[8] Sogang Univ, Dept Mech Engn, Seoul 04107, South Korea
基金
新加坡国家研究基金会; 美国国家科学基金会;
关键词
thermal expansion; anisotropy; polymerthinfilm; microstructure; soft matters; THIN-FILMS; ELECTRICAL-CONDUCTIVITY; TRANSITION-TEMPERATURE; MOLECULAR-WEIGHT; BEHAVIOR; COEFFICIENT; THICKNESS;
D O I
10.1021/acsami.3c03728
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Whiledimensional change under thermal loading dictates variousdevice failure mechanisms in soft materials, the interplay betweenmicrostructures and thermal expansion remains underexplored. Here,we develop a novel method to directly probe the thermal expansionfor nanoscale polymer films using an atomic force microscope as wellas confining active thermal volume. In a model system, spin-coatedpoly-(methyl methacrylate), we find that the in-plane thermal expansionis enhanced by 20-fold compared to that along the out-of-plane directionsin confined dimensions. Our molecular dynamics simulations show thatthe collective motion of side groups along backbone chains uniquelydrives the enhancement of thermal expansion anisotropy of polymersin the nanoscale limit. This work unveils the intimate role of themicrostructure of polymer films on its thermal-mechanical interaction,paving a route to judiciously enhance the reliability in a broad rangeof thin-film devices.
引用
收藏
页码:27166 / 27172
页数:7
相关论文
共 42 条
[1]   Conformation of single poly(methyl methacrylate) chains in an ultra-thin film studied by scanning near-field optical microscopy [J].
Aoki, Hiroyuki ;
Morita, Sayuri ;
Sekine, Ryojun ;
Ito, Shinzaburo .
POLYMER JOURNAL, 2008, 40 (03) :274-280
[2]   Chain-mixing behavior at interface between polystyrene brushes and polystyrene matrices [J].
Arita, Hiroshi ;
Mitamura, Koji ;
Kobayashi, Motoyasu ;
Yamada, Norifumi L. ;
Jinnai, Hiroshi ;
Takahara, Atsushi .
POLYMER JOURNAL, 2013, 45 (01) :117-123
[3]   Polymer photocatalysts for solar-to-chemical energy conversion [J].
Banerjee, Tanmay ;
Podjaski, Filip ;
Kroeger, Julia ;
Biswal, Bishnu P. ;
Lotsch, Bettina, V .
NATURE REVIEWS MATERIALS, 2021, 6 (02) :168-190
[4]   Highly Sensitive Temperature Sensor: Ligand-Treated Ag Nanocrystal Thin Films on PDMS with Thermal Expansion Strategy [J].
Bang, Junsung ;
Lee, Woo Seok ;
Park, Byeonghak ;
Joh, Hyungmok ;
Woo, Ho Kun ;
Jeon, Sanghyun ;
Ahn, Junhyuk ;
Jeong, Chanho ;
Kim, Toe-il ;
Oh, Soong Ju .
ADVANCED FUNCTIONAL MATERIALS, 2019, 29 (32)
[5]   Algorithm for calculating the thermal expansion tensor and constructing the thermal expansion diagram for crystals [J].
Belousov, R. I. ;
Filatov, S. K. .
GLASS PHYSICS AND CHEMISTRY, 2007, 33 (03) :271-275
[6]   THERMAL-CONDUCTIVITY MEASUREMENT FROM 30-K TO 750-K - THE 3-OMEGA METHOD [J].
CAHILL, DG .
REVIEW OF SCIENTIFIC INSTRUMENTS, 1990, 61 (02) :802-808
[7]   Thermal expansion characterization of thin films using harmonic Joule heating combined with atomic force microscopy [J].
Chaikasetsin, Settasit ;
Kodama, Takashi ;
Bae, Kiho ;
Jung, Jun Young ;
Shin, Jeeyoung ;
Lee, Byung Chul ;
Kim, Brian S. Y. ;
Seo, Jungju ;
Sim, Uk ;
Prinz, Fritz B. ;
Goodson, Kenneth E. ;
Park, Woosung .
APPLIED PHYSICS LETTERS, 2021, 118 (19)
[8]   Visualizing the Orientation of Single Polymers Induced by Spin- Coating [J].
Chan, Jonathan M. ;
Wang, Muzhou .
NANO LETTERS, 2022, 22 (14) :5891-5897
[9]   OUT-OF-PLANE THERMAL-EXPANSION COEFFICIENT OF BIPHENYLDIANHYDRIDE-PHENYLENEDIAMINE POLYIMIDE FILM [J].
CHEN, ST ;
WAGNER, HH .
JOURNAL OF ELECTRONIC MATERIALS, 1993, 22 (07) :797-799
[10]  
Dames C, 2013, Annu. Rev. Heat Transf., V16, P7, DOI DOI 10.1615/ANNUALREVHEATTRANSFER.V16.20