Achieving robust and enhanced pool boiling heat transfer using micro-nano multiscale structures

被引:23
作者
Wang, Xiaoliang [1 ,2 ]
Xu, Jie [1 ,2 ]
Jiang, Hongpeng [1 ,2 ]
Liu, Yongda [1 ,2 ]
Li, Xinru [1 ,2 ]
Shan, Debin [1 ,2 ]
Guo, Bin [1 ,2 ]
机构
[1] Harbin Inst Technol, Minist Educ, Key Lab Microsyst & Microstruct Mfg, Harbin 150080, Peoples R China
[2] Harbin Inst Technol, Sch Mat Sci & Engn, Harbin 150001, Peoples R China
基金
中国国家自然科学基金;
关键词
Pool boiling; Heat transfer enhancement; Micro-nano multiscale structure; Superhydrophilic; Capillary wick; Robustness; SURFACE-ROUGHNESS; DESIGN; WATER; FLUX;
D O I
10.1016/j.applthermaleng.2023.120441
中图分类号
O414.1 [热力学];
学科分类号
摘要
Vapor chamber thermal management technology has become a high-reliability cooling method to solve the heat dissipation problem. However, this is still a crucial challenge to overcome when the capillary wick is exposed to harsh service environments. In this paper, a fabrication method of capillary wicks with micro-nano multiscale structures combining micro hot embossing and high-pressure hydrothermal treatment is proposed. Micro pyramid-channel is fabricated by micro hot embossing, and when the axis-to-diameter ratio of nanobars reaches 3.16-3.17, superhydrophilicity is realized. In the pool boiling experiment, the heat transfer performance of the pyramid-channel is better than that of the triangular-channel. Importantly, the superhydrophilic micro-nano structures achieve significantly improved critical heat flux and heat transfer coefficient simultaneously, increased by 162.1% and 180.8%. Moreover, the fabricated micro-nano capillary wick, which comprise high-strength pyramid-channel and specific wettability nanostructures, can maintain their outstanding superhydrophilicity and superhydrophobicity and their enhanced boiling property even after high-pressure high-velocity fluid scouring. The proposed cost-effective fabrication method provides an ideal and industrialized approach for the mass production of vapor chamber capillary wicks suitable for severe application environments.
引用
收藏
页数:16
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