Effect of whisker alignment on microstructure, mechanical and thermal properties of Mg-SiCw/Cu composite fabricated by a combination of casting and severe plastic deformation (SPD)

被引:44
作者
Wang, Yinwei [1 ]
Tayyebi, Moslem [2 ]
Tayebi, Morteza [3 ]
Yarigarravesh, Mahdireza [4 ]
Liu, Shoufa [1 ]
Zhang, Hongwei [1 ]
机构
[1] Xijing Univ, Sch Mech Engn, Xian 710123, Shaanxi, Peoples R China
[2] Shiraz Univ Technol, Dept Mat Sci & Engn, Shiraz, Iran
[3] Islamic Azad Univ, Sci & Res Branch, Young Researchers & Elites Club, Tehran, Iran
[4] Sharif Univ Technol, Dept Civil Engn, Tehran, Iran
关键词
SiC whisker; Warm accumulative roll bonding; Stir; -casting; Thermal conductivity; METAL-MATRIX COMPOSITES; DYNAMIC RECRYSTALLIZATION; TEXTURE EVOLUTION; SIC PARTICLES; MAGNESIUM; BEHAVIOR; CONDUCTIVITY; ALLOY; CHALLENGES; EXTRUSION;
D O I
10.1016/j.jma.2022.11.004
中图分类号
TF [冶金工业];
学科分类号
0806 ;
摘要
In this research, microstructure evaluation, mechanical properties and thermal conductivity of the Mg-SiC w /Cu composite with laminar structure were investigated. For this purpose, SiC whiskers were added to magnesium alloy by using stir-casting, then the Mg-SiC w composite was bonded to copper layers by warm accumulative roll bonding (ARB). Based on the results of optical microscopy (OM) and scanning electron microscopy (SEM), SiC whiskers were well distributed in the magnesium matrix and they were aligned parallelly when the composites were plastically deformed at higher rolling passes. Furthermore, all layers remained continuous with localized necking sites. Also, no intermetallic compounds and phases were detected by XRD and EDS analyzes. Apart from the significant effect of severe plastic deformation on mechanical properties, the findings of mechanical tests point to the usefulness of reinforcements in improving up to 60% microhardness, Young's modulus, yield, and up to 41% tensile strengths. Further, thermal conductivities of composites increased by adding reinforcement and above all by increasing the number of rolling passes. This growth is attributed to the higher thermal diffusivity of copper and whiskers as well as the increased number of conductive layers within composite. (c) 2022 Chongqing University. Publishing services provided by Elsevier B.V. on behalf of KeAi Communications Co. Ltd. This is an open access article under the CC BY-NC-ND license ( http://creativecommons.org/licenses/by-nc-nd/4.0/ ) Peer review under responsibility of Chongqing University
引用
收藏
页码:966 / 980
页数:15
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