Electronic properties and passivation mechanism of AlGaN/GaN heterojunction with vacancies: a DFT study

被引:3
作者
Li, Leilei [1 ]
He, Shanshan [1 ]
Tu, Yuhang [1 ]
Guo, Bingrui [2 ]
Liu, Fei [3 ]
He, Shan [1 ]
Li, Qiuhong [1 ]
Guo, Donghui [1 ]
机构
[1] Xiamen Univ, Coll R&D Ctr Integrated Circuit, Fujian 361005, Peoples R China
[2] Calif Univ, Dept Appl Math Comp Sci, San Diego, CA 92093 USA
[3] Peking Univ, Coll Integrated Circuits, Beijing 100871, Peoples R China
基金
国家重点研发计划;
关键词
first-principles calculation; AlGaN; GaN heterojunction; vacancy defect; passivation; TOTAL-ENERGY CALCULATIONS; HOT-CARRIER DEGRADATION; PLASMA TREATMENT; GALLIUM NITRIDE; GAN HEMTS; 1ST-PRINCIPLES; MOBILITY; DEFECTS; SEMICONDUCTORS; APPROXIMATION;
D O I
10.1088/1402-4896/acccb3
中图分类号
O4 [物理学];
学科分类号
0702 ;
摘要
A significant issue for GaN-based high-electron-mobility transistors (HEMTs) in high power devices is the material defect, particularly the defect states generated by the defects, which has a negative impact on the device carrier concentration and carrier transport. Based on density functional theory (DFT), we investigate the microscopic properties of different type point vacancies in the AlGaN/GaN heterojunction. It is found that N vacancy introduces defect states near the conduction band minimum (CBM) of the GaN layer and AlGaN/GaN interface. Ga and Al vacancies introduce defect states near the valence band maximum (VBM) in bulk and interface of AlGaN/GaN heterojunction. Moreover, Al vacancy is more likely to be an effective candidate for acceptor defect than Ga vacancy. We further study several AlGaN/GaN interface passivation schemes by introducing F, V group element P, and III group element B at the AlGaN/GaN heterojunction interface to analyze the passivation mechanism. According to the results of the passivation models, B passivation of Ga and Al vacancies is an effective method to completely remove the defect states from Ga and Al vacancy defects. Combining the III and V groups elements into the passivated process may be effective in achieving high-quality AlGaN/GaN heterojunction interface for the future GaN-based HEMTs fabrication.
引用
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页数:10
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