Effective decoupling of grain boundaries and secondary phase interfaces for enhanced thermoelectric performance of Cu1.8S/WS2 nanocomposites

被引:6
作者
Sundari, R. Shanmuka [1 ]
Vijay, V. [1 ]
Shalini, V. [1 ]
Harish, S. [1 ,2 ]
Shimomura, M. [2 ]
Archana, J. [1 ]
Ponnusamy, S. [1 ]
Navaneethan, M. [1 ,3 ]
机构
[1] SRM Inst Sci & Technol, Dept Phys & Nanotechnol, Funct Mat & Energy Devices Lab, Kattankulathur 603203, India
[2] Shizuoka Univ, Grad Sch Sci & Technol, 3-5-1 Johoku, Naka-Ku, Hamamatsu, Shizuoka 4328011, Japan
[3] SRM Inst Sci & Technol, Nanotechnol Res Ctr, Kattankulathur 603203, India
关键词
Cu1.8S/WS2; Superionic behavior; Secondary phase; Grain boundary scattering; Thermal conductivity; DISTORTION;
D O I
10.1016/j.jallcom.2023.170796
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
Copper Sulfide (Cu1.8S) has influentially concerned the increasing attention in mid-temperature thermoelectric materials. The inherent low Seebeck coefficient and high thermal conductivity of Cu1.8S hinders the thermoelectric performance. The superionic conductivity exhibited by Cu1.8S phase possess characteristic phonon-liquid electron-crystal property eliminate transverse phonon vibrations. In this study, improved thermoelectric performance for the Cu1.8S material was obtained through the efficient strategy of compositing with WS2 nanoparticles. A minimum thermal conductivity of 1.4 W/mK at 753 K for the Cu1.8S/5 wt. % WS2 nanocomposite. Along with the increased Seebeck coefficient values, the thermal conductivity is suppressed by WS2 composite due to the formation of Cu2WS4 secondary phase which strengthens the phonon scattering. The evident reduction in the thermal conductivity, coupled with less affected Seebeck coefficient, led to increased figure of merit (zT) of 0.46 at 753 K, which is 95 % higher than that of pure Cu1.8S. This work provides a distinguished improvement in the performance of Cu1.8S thermoelectric material thereby enabling its employment in the application of waste heat harvesting. (c) 2023 Elsevier B.V. All rights reserved.
引用
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页数:13
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