3D Structural Electronics Via Multi-Directional Robot 3D Printing

被引:17
作者
Bao, Chao [1 ]
Moeinnia, Hadi [1 ]
Kim, Tae-Ho [1 ]
Lee, Wonchul [1 ]
Kim, Woo Soo [1 ]
机构
[1] Simon Fraser Univ, Sch Mechatron Syst Engn, Surrey, BC V3T 0A3, Canada
基金
加拿大自然科学与工程研究理事会;
关键词
multi-layered PCBs; multi-material 3D printing; structural electronic;
D O I
10.1002/admt.202201349
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Multi-material 3D printing is an innovative technology that sparks a revolution in combined structural 3D printing with different functional materials. However, current multi-material printing systems work alone and cannot take full advantage of each printing, and the limited freedom of existing 3D printers confines diversity of structural designs. Here, a double-arm robotic 3D printing system combined with paste-based direct ink writing (DIW) and filament-based fused filament fabrication (FFF) is reported as a new fabrication solution for customized 3D structural electronics. Collaboration between two robot arms brings about a spontaneous sintering effect of metal nano-particles (minimum resistance = 14.5 ohm per 10 mm) by addition of the following extruded layer through FFF for the fabrication of embedded sensors, which reduces the post-processing steps and saves energy for sintering compared with the conventional parallel multi-material 3D printing processes. The extra freedom of motions from two robot-arm 3D printing enables multi-directional curvilinear printing for 3D structural electronics, such as a double-helix-shaped embedded sensor. In addition, precise robot motion enables the electrical registration and vertical integration of multi-layered printed circuit boards. Establishment of new double-robot 3D printing system expands design freedom and realization of 3D structural electronics.
引用
收藏
页数:9
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