Heat transfer performance of flat micro-heat pipe with sintered multi-size copper powder wick

被引：30
作者：
Zhao, Zhengang [1 ,2 ]
Peng, Guohong [1 ]
Zhang, Yanhui [1 ]
Zhang, Dacheng [1 ,3 ]
机构：
[1] Kunming Univ Sci & Technol, Fac Informat Engn & Automat, Kunming 650500, Peoples R China
[2] Elect Power Measurement Digitalizat Control & Prot, Yunnan Key Lab Green Energy, Kunming 650500, Peoples R China
[3] Yunnan Key Lab Comp Technol Applicat, Kunming 650500, Peoples R China
来源：
CASE STUDIES IN THERMAL ENGINEERING | 2023年 / 42卷
基金：
美国国家科学基金会;
关键词：
Micro-heat pipe; Multi-size powder wick; Capillary pressure; Thermal resistance; CAPILLARY PERFORMANCE; THERMAL PERFORMANCE; COMPOSITE WICK;
D O I：
10.1016/j.csite.2023.102720
中图分类号：
O414.1 [热力学];
学科分类号：
摘要：
The heat flux rises dramatically as electronic circuits become more integrated. Flat micro-heat pipe (FMHP) is a popular device for high heat flux management. A novel sintered multi-size copper powder wick (SMW) is designed in this paper. The evaporator and condenser section of the SMW is a double-layer structure with two copper powder diameters. The adiabatic section is a single-layer structure. Copper powder sintering is a compelling method to achieve graded pore size design. SMW and six sintered single-size copper powder wicks (SSWs) are prepared by vacuum sintering of copper powder. The capillary pressure of wicks and heat transfer characteristics of FMHPs are experimentally investigated. The results show that the liquid transfer time of the SMW is shortened 16.59% compared to that of the SSW. The dynamic response time constant of the SMW FMHP is decreased by 0.9 s, and the overall thermal resistance is reduced by 14.22%. The heat pipe made in this study is more agreeable to heat dissipation and is of importance for thermal management in power devices.
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页数：12
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