Elliptical vibration chiseling: a novel process for texturing ultra-high-aspect-ratio microstructures on the metallic surface

被引:13
作者
Li, Zhiwei [1 ,2 ]
Zhang, Jianfu [1 ,2 ]
Zheng, Zhongpeng [1 ,2 ]
Feng, Pingfa [1 ,2 ,3 ]
Yu, Dingwen [1 ,2 ]
Wang, Jianjian [1 ,2 ]
机构
[1] Tsinghua Univ, Dept Mech Engn, State Key Lab Tribol Adv Equipment, Beijing 100084, Peoples R China
[2] Tsinghua Univ, Dept Mech Engn, Beijing Key Lab Precis Ultraprecis Mfg Equipments, Beijing 100084, Peoples R China
[3] Tsinghua Univ, Shenzhen Int Grad Sch, Div Adv Mfg, Shenzhen 518055, Peoples R China
基金
中国国家自然科学基金; 中国博士后科学基金; 北京市自然科学基金;
关键词
metallic microstructure; high aspect ratio; backward-moving cutting; vibration cutting; chiseling; material deformation; FAST TOOL SERVO; FABRICATION; NANOSTRUCTURES; GENERATION; ARRAY; ENHANCEMENT; MECHANICS; DESIGN; MOTION; GROOVE;
D O I
10.1088/2631-7990/ad1bbb
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
High-aspect-ratio metallic surface microstructures are increasingly demanded in breakthrough applications, such as high-performance heat transfer enhancement and surface plasmon devices. However, the fast and cost-effective fabrication of high-aspect-ratio microstructures on metallic surfaces remains challenging for existing techniques. This study proposes a novel cutting-based process, namely elliptical vibration chiseling (EV-chiseling), for the high-efficiency texturing of surface microstructures with an ultrahigh aspect ratio. Unlike conventional cutting, EV-chiseling superimposes a microscale EV on a backward-moving tool. The tool chisels into the material in each vibration cycle to generate an upright chip with a high aspect ratio through material deformation. Thanks to the tool's backward movement, the chip is left on the material surface to form a microstructure rather than falling off. Since one microstructure is generated in one vibration cycle, the process can be highly efficient using ultrafast (>1 kHz) tool vibration. A finite element analysis model is established to explore the process mechanics of EV-chiseling. Next, a mechanistic model of the microstructured surface generation is developed to describe the microstructures' aspect ratio dependency on the process parameters. Then, surface texturing tests are performed on copper to verify the efficacy of EV-chiseling. Uniformed micro ribs with a spacing of 1-10 mu m and an aspect ratio of 2-5 have been successfully textured on copper. Compared with the conventional EV-cutting that uses a forward-moving tool, EV-chiseling can improve the aspect ratio of textured microstructure by up to 40 times. The experimental results also verify the accuracy of the developed surface generation model of microstructures. Finally,the effects of elliptical trajectory, depth of cut, tool shape, and tool edge radius on the surface generation of micro ribs have been discussed.
引用
收藏
页数:19
相关论文
共 40 条
  • [1] Uniform Metal-Assisted Chemical Etching for Ultra-High-Aspect-Ratio Microstructures on Silicon
    Li, Liyi
    Tuan, Chia-Chi
    Zhang, Cheng
    Chen, Yun
    Lian, Gang
    Wong, Ching-Ping
    JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2019, 28 (01) : 143 - 153
  • [2] Production of metallic high aspect ratio microstructures by microcasting
    G. Baumeister
    K. Mueller
    R. Ruprecht
    J. Hausselt
    Microsystem Technologies, 2002, 8 (2) : 105 - 108
  • [3] Massively-parallel ultra-high-aspect-ratio nanochannels as mesoporous membranes
    Mao, Pan
    Han, Jongyoon
    LAB ON A CHIP, 2009, 9 (04) : 586 - 591
  • [4] Vertical Si nanowire with ultra-high-aspect-ratio by combined top-down processing technique
    Nakamura, Jun
    Higuchi, Kohei
    Maenaka, Kazusuke
    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2013, 19 (03): : 433 - 438
  • [5] Preparation of high aspect ratio surface microstructures out of a Zr-based bulk metallic glass
    Kündig, AA
    Cucinelli, M
    Uggowitzer, PJ
    Dommann, A
    MICROELECTRONIC ENGINEERING, 2003, 67-8 : 405 - 409
  • [6] Development and characterization of ultra high aspect ratio microstructures made by ultra deep X-ray lithography
    Nazmov, Vladimir
    Reznikova, Elena
    Mohr, Juergen
    Schulz, Joachim
    Voigt, Anja
    JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2015, 225 : 170 - 177
  • [7] Investigations of SU-8 removal from metallic high aspect ratio microstructures with a novel plasma technique
    Rainer Engelke
    Josef Mathuni
    Gisela Ahrens
    Gabi Gruetzner
    Martin Bednarzik
    Daniel Schondelmaier
    Bernd Loechel
    Microsystem Technologies, 2008, 14 : 1607 - 1612
  • [8] Dynamic Analysis of the Demolding Process for PDMS Microstructures with High Aspect Ratio
    Liu, Chih-Hsing
    Chen, Wenjie
    2013 IEEE/ASME INTERNATIONAL CONFERENCE ON ADVANCED INTELLIGENT MECHATRONICS (AIM): MECHATRONICS FOR HUMAN WELLBEING, 2013, : 223 - 228
  • [9] Profile and surface measurement tool for high aspect-ratio microstructures
    Pourciel, JB
    Jalabert, L
    Masuzawa, T
    JSME INTERNATIONAL JOURNAL SERIES C-MECHANICAL SYSTEMS MACHINE ELEMENTS AND MANUFACTURING, 2003, 46 (03) : 916 - 922
  • [10] A LIGA-like process for high-aspect ratio PZT microstructures
    Lee, GS
    Jin, YY
    Park, SJ
    Ajmera, PK
    Malek, CK
    Wang, JT
    Tang, F
    SMART STRUCTURES AND MATERIALS 1999: SMART ELECTRONICS AND MEMS, 1999, 3673 : 127 - 132