Graphene-Based ESD Protection for Future ICs

被引:0
|
作者
Li, Cheng [1 ]
Pan, Zijin [1 ]
Hao, Weiquan [1 ]
Li, Xunyu [1 ]
Miao, Runyu [1 ]
Wang, Albert [1 ]
机构
[1] Univ Calif Riverside, Dept Elect & Comp Engn, Riverside, CA 92521 USA
关键词
ESD protection; gNEMS; interconnects; switch; graphene; TLP; VFTLP; HBM; CDM; DESIGN; SWITCH;
D O I
10.3390/nano13081426
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
On-chip electrostatic discharge (ESD) protection is required for all integrated circuits (ICs). Conventional on-chip ESD protection relies on in-Si PN junction-based device structures for ESD. However, such in-Si PN-based ESD protection solutions pose significant challenges related to ESD protection design overhead, including parasitic capacitance, leakage current, and noises, as well as large chip area consumption and difficulty in IC layout floor planning. The design overhead effects of ESD protection devices are becoming unacceptable to modern ICs as IC technologies continuously advance, which is an emerging design-for-reliability challenge for advanced ICs. In this paper, we review the concept development of disruptive graphene-based on-chip ESD protection comprising a novel graphene nanoelectromechanical system (gNEMS) ESD switch and graphene ESD interconnects. This review discusses the simulation, design, and measurements of the gNEMS ESD protection structures and graphene ESD protection interconnects. The review aims to inspire non-traditional thinking for future on-chip ESD protection.
引用
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页数:16
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