Establishing copper-zinc alloying strategy via active screen plasma toward stabilized zinc metal anode

The problematic Zn dendrite for Zn anodes remains a great challenge. Constructing an artificial Cu-Zn alloy layer is one of the most potential solutions. However, it is still challenging to prepare an ideal Cu-Zn alloy layer with good morphology and controllable thickness. Herein, a special plasma-based method of active screen plasma (ASP) is first reported to create a hexagonal close-packed CuZn5 alloy layer with controllable morphology and thickness. Meanwhile, a "vaporization-redeposition " mode is proposed to illustrate the alloying process. Based upon system analysis, the CuZn5 layer with good uniformity and appropriate thickness can regulate the behavior of Zn-ion at electrode/electrolyte interface. The former homogenizes the electric field distribution, while the latter enhances de-solvation ability of Zn-ion, facilitating Zn-ion diffusion. Consequently, the CuZn5-coated Zn anodes display lower polarization potential and longer cycling life. Such CuZn5-coated Zn anodes enable an outstanding cycle stability for Zn-based devices, and the pouch devices also deliver practicality.