Preparation of silver nanopowders and its application in low temperature electrically conductive adhesive

Printable electrically conductive adhesive with high electrical conductivity and good mechanical properties has a broad application prospect in electronic devices. In order to explore the preparation method of high-purity nanometal conductive filler for conductive adhesive, silver nanopowders were prepared by DC arc plasma method. The silver nanopowders present a spherical structure and the average particle size is 55 nm. In this paper, a high performance electrically conductive adhesive (ECA) was prepared. This ECA was fabricated by mixing silver nanopowders with epoxy resin and screen-printed to a required shape. It was found that the ECA can be solidified through a low temperature sintering method in the air at 150 degrees C for 10 min. The electrical and mechanical properties of above ECA were investigated and characterized. The ECA filled with 75 % silver nanopowders exhibits excellent performances, including high electrical conductivity (9.8 x 10-3 Omega.cm) and high bonding strength (8.3 MPa). Based on the performance characteristics, the ECA applications in flexible printed electrodes and interconnecting materials are demonstrated.