Microstructures and properties of copper matrix composite wires reinforced with Ti2SnC particles

被引：5

作者：

Jahani, Amirhossein ^{[1
]}

Aval, Hamed Jamshidi ^{[1
,2
]}

Rajabi, Mohammad ^{[1
]}

Jamaati, Roohollah ^{[1
]}

机构：

[1] Babol Noshirvani Univ Technol, Dept Mat Engn, Babol, Iran

[2] Babol Noshirvani Univ Technol, Dept Mat Engn, Shariati Ave, Babol 47148 71167, Iran

来源：

MATERIALS SCIENCE AND TECHNOLOGY | 2023年 / 39卷 / 13期

关键词：

Copper matrix composite; Ti2SnC reinforcement; mechanical properties; microstructure; electrical conductivity; ELECTRICAL-PROPERTIES; CU-TI3ALC2; FRICTION; DISPERSION; BEHAVIOR;

D O I：

10.1080/02670836.2023.2180595

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This study investigates the fabrication of copper matrix composite reinforced with 8 wt-% of the Ti2SnC phase using friction stir-back extrusion. It explores the effect of rotational speed on the microstructure and properties of Cu-Ti2SnC wire composites. The results showed that the grain size of the composite increased from 3.5 +/- 0.6 to 5.7 +/- 0.5 mu m as the rotation speed increased from 400 to 1000 rev min(-1). With the addition of the Ti2SnC phase, the yield and ultimate tensile strength increased by 178% and 33%, respectively. In addition, although the electrical conductivity decreased by 25% by adding 8 wt-% of reinforcement, the electric conductivity of composite wire increased by 19% with the increase of the rotation speed from 400 to 1000 rev min(-1).

引用

页码：1670 / 1686

页数：17

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