Microstructures and properties of copper matrix composite wires reinforced with Ti2SnC particles

被引:3
作者
Jahani, Amirhossein [1 ]
Aval, Hamed Jamshidi [1 ,2 ]
Rajabi, Mohammad [1 ]
Jamaati, Roohollah [1 ]
机构
[1] Babol Noshirvani Univ Technol, Dept Mat Engn, Babol, Iran
[2] Babol Noshirvani Univ Technol, Dept Mat Engn, Shariati Ave, Babol 47148 71167, Iran
关键词
Copper matrix composite; Ti2SnC reinforcement; mechanical properties; microstructure; electrical conductivity; ELECTRICAL-PROPERTIES; CU-TI3ALC2; FRICTION; DISPERSION; BEHAVIOR;
D O I
10.1080/02670836.2023.2180595
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This study investigates the fabrication of copper matrix composite reinforced with 8 wt-% of the Ti2SnC phase using friction stir-back extrusion. It explores the effect of rotational speed on the microstructure and properties of Cu-Ti2SnC wire composites. The results showed that the grain size of the composite increased from 3.5 +/- 0.6 to 5.7 +/- 0.5 mu m as the rotation speed increased from 400 to 1000 rev min(-1). With the addition of the Ti2SnC phase, the yield and ultimate tensile strength increased by 178% and 33%, respectively. In addition, although the electrical conductivity decreased by 25% by adding 8 wt-% of reinforcement, the electric conductivity of composite wire increased by 19% with the increase of the rotation speed from 400 to 1000 rev min(-1).
引用
收藏
页码:1670 / 1686
页数:17
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