A Future Outlook of Power Devices From the Viewpoint of Power Electronics Trends

被引：5
作者：
Saito, Wataru [1 ]
机构：
[1] Kyushu Univ, Res Inst Appl Mech, Fukuoka 8168580, Japan
来源：
IEEE TRANSACTIONS ON ELECTRON DEVICES | 2024年 / 71卷 / 03期
关键词：
Business; Market research; Integrated circuits; Force; Inverters; Power electronics; Power system measurements; Power devices; power electronics; power modules; SILICON-CARBIDE MOSFET; DESIGN AUTOMATION; HIGH-TEMPERATURE; MODULE; CONVERTERS; EVOLUTION;
D O I：
10.1109/TED.2023.3332611
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A outlook for power devices is discussed from the perspectives of power device and power electronics application trends. The driving force of the power device business has changed from home appliances and industrial robots to electric vehicles (EV), and the most important trend has been the increase in power density in power modules by power loss reduction, high-temperature operation, and thermal resistance reduction. In the future, it can be expected that inverter-based resources and power supply integrated circuits (ICs) will be new driving forces for green transformation (GX) and digital transformation (DX). To continue the increasing power density trend of power modules, wide bandgap power devices are attractive. However, economic parameters, such as "cost/power", must be improved for wide installation in power grids with large volumes. In addition, it can be expected that hetero integration into power modules and GaN power ICs will be a new demand.
引用
收藏
页码：1356 / 1364
页数：9
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