Enhanced heat transfer of liquid film evaporation via subdividable patterned surfaces

Surface wettability is significant in evaporation. The wettability pattern combinations on evaporation heat transfer under a fixed proportion of wettability is explored by molecular dynamics (MD) simulation. The microscopic mechanisms affecting evaporation heat transfer are elucidated by analyzing the liquid-vapor and solid-liquid interfaces. Interfacial heat transfer between solid and liquid is examined in terms of interfacial thermal resistance, potential energy distribution, and interaction energy. Simulation results demonstrate that heat transfer is significantly affected by the solid-liquid interface. Then, the liquid-vapor interfacial potential energy and areas are nearly identical. This means patterned combinations have no effect on heat transfer across liquid-vapor interface. What's more, the heat transfer rate is positively related to the total length of the contact boundary line between the hydrophilic and hydrophobic parts. Therefore, a mathematical relationship can be established to optimize the surface construction with better heat transfer performance by solving the extending length of the contact boundary line. By MD simulation verification, the case with a longer contact boundary line performs better heat transfer characteristics.