Aerosol Jet Printing of Phase-Inversion Graphene Inks for High-Aspect-Ratio Printed Electronics and Sensors
被引:7
作者:
Gamba, Livio
论文数: 0引用数: 0
h-index: 0
机构:
Iowa State Univ, Dept Mech Engn, Ames, IA 50010 USAIowa State Univ, Dept Mech Engn, Ames, IA 50010 USA
Gamba, Livio
[1
]
Diaz-Arauzo, Santiago
论文数: 0引用数: 0
h-index: 0
机构:
Northwestern Univ, Dept Mat Sci & Engn, Evanston, IL 60208 USAIowa State Univ, Dept Mech Engn, Ames, IA 50010 USA
Diaz-Arauzo, Santiago
[2
]
Hersam, Mark C.
论文数: 0引用数: 0
h-index: 0
机构:
Northwestern Univ, Dept Mat Sci & Engn, Evanston, IL 60208 USA
Northwestern Univ, Dept Chem, Evanston, IL 60208 USA
Northwestern Univ, Dept Elect & Comp Engn, Evanston, IL 60208 USAIowa State Univ, Dept Mech Engn, Ames, IA 50010 USA
Hersam, Mark C.
[2
,3
,4
]
Secor, Ethan B.
论文数: 0引用数: 0
h-index: 0
机构:
Iowa State Univ, Dept Mech Engn, Ames, IA 50010 USAIowa State Univ, Dept Mech Engn, Ames, IA 50010 USA
Secor, Ethan B.
[1
]
机构:
[1] Iowa State Univ, Dept Mech Engn, Ames, IA 50010 USA
[2] Northwestern Univ, Dept Mat Sci & Engn, Evanston, IL 60208 USA
[3] Northwestern Univ, Dept Chem, Evanston, IL 60208 USA
[4] Northwestern Univ, Dept Elect & Comp Engn, Evanston, IL 60208 USA
Aerosol jet printing is a technology particularly suited for additive manufacturing of functional microstructures, offering resolutions as high as 10 mu m, broad compatibility for electronic nanomaterials, and noncontact deposition, making it compelling for device prototyping and conformal printing. To adapt this method from thin film patterns to taller features, both ink rheology and drying kinetics require careful engineering. Printing in a solvent-rich, low-viscosity state commonly results in a puddle, with liquid-phase spreading and susceptibility to instabilities, whereas printing solvent-depleted aerosol results in a granular morphology with high overspray. Here, we demonstrate a strategy to mitigate this trade-off by tailoring the evolution of ink rheology during the process, using a graphene ink containing the nonsolvent glycerol as an exemplar. During droplet transport to the nozzle, evaporation of volatile primary solvents increases the glycerol concentration, resulting in gel formation. This switch in the ink rheology between the cartridge and substrate maintains the print resolution at high deposition rates. Moreover, multiple layers can be printed in rapid succession to build up high aspect ratio microstructures, as demonstrated by continuously printed cylindrical pillars with diameters on the order of similar to 100 mu m and aspect ratios as high as similar to 10. Finally, the efficacy of this ink formulation strategy for a CuO nanoparticle ink confirms the generalizability of this strategy for a broader scope of colloidal nanomaterial inks. In addition to its utility for microscale additive manufacturing of 2.5D structures, this strategy provides insights into higher deposition rate patterning to improve scalability and throughput of aerosol jet printing.
机构:
Carnegie Mellon Univ, Dept Mech Engn, Pittsburgh, PA 15213 USACarnegie Mellon Univ, Dept Mech Engn, Pittsburgh, PA 15213 USA
Hu, Chunshan
Yuan, Bin
论文数: 0引用数: 0
h-index: 0
机构:
Carnegie Mellon Univ, Dept Mech Engn, Pittsburgh, PA 15213 USACarnegie Mellon Univ, Dept Mech Engn, Pittsburgh, PA 15213 USA
Yuan, Bin
Jahan, Sanjida
论文数: 0引用数: 0
h-index: 0
机构:
Carnegie Mellon Univ, Dept Mech Engn, Pittsburgh, PA 15213 USACarnegie Mellon Univ, Dept Mech Engn, Pittsburgh, PA 15213 USA
Jahan, Sanjida
论文数: 引用数:
h-index:
机构:
Saleh, Mohammad S.
Guo, Zhitao
论文数: 0引用数: 0
h-index: 0
机构:
Carnegie Mellon Univ, Dept Chem Engn, Pittsburgh, PA 15213 USA
Carnegie Mellon Univ, Wilton E Scott Inst Energy Innovat, Pittsburgh, PA 15213 USACarnegie Mellon Univ, Dept Mech Engn, Pittsburgh, PA 15213 USA
Guo, Zhitao
Gellman, Andrew J.
论文数: 0引用数: 0
h-index: 0
机构:
Carnegie Mellon Univ, Dept Chem Engn, Pittsburgh, PA 15213 USA
Carnegie Mellon Univ, Wilton E Scott Inst Energy Innovat, Pittsburgh, PA 15213 USACarnegie Mellon Univ, Dept Mech Engn, Pittsburgh, PA 15213 USA
机构:
Harvard Univ, Rowland Inst, Cambridge, MA 02142 USA
Swiss Fed Inst Technol, Dept Civil Environm & Geomat Engn, Inst Environm Engn, Environm Microfluid Grp, CH-8093 Zurich, SwitzerlandIntel Corp, Technol Dev Grp, Hillsboro, OR 97124 USA
Baumgartner, Dieter A.
论文数: 引用数:
h-index:
机构:
Shiri, Samira
Sinha, Shayandev
论文数: 0引用数: 0
h-index: 0
机构:
Intel Corp, Technol Dev Grp, Hillsboro, OR 97124 USA
Harvard Univ, Rowland Inst, Cambridge, MA 02142 USAIntel Corp, Technol Dev Grp, Hillsboro, OR 97124 USA
Sinha, Shayandev
Karpitschka, Stefan
论文数: 0引用数: 0
h-index: 0
机构:
Max Planck Inst Dynam & Self Org, D-37077 Gottingen, GermanyIntel Corp, Technol Dev Grp, Hillsboro, OR 97124 USA
Karpitschka, Stefan
Cira, Nate J.
论文数: 0引用数: 0
h-index: 0
机构:
Harvard Univ, Rowland Inst, Cambridge, MA 02142 USA
Cornell Univ, Dept Biomed Engn, Ithaca, NY 14850 USAIntel Corp, Technol Dev Grp, Hillsboro, OR 97124 USA
机构:
Air Force Res Lab, Mat & Mfg Directorate, Soft Matter Branch, Wright Patterson AFB, OH 45433 USA
Wright State Univ, Dept Mech & Mat Engn, Dayton, OH 45435 USAAir Force Res Lab, Mat & Mfg Directorate, Soft Matter Branch, Wright Patterson AFB, OH 45433 USA
Blake, Aaron J.
Kohlmeyer, Ryan R.
论文数: 0引用数: 0
h-index: 0
机构:
Air Force Res Lab, Mat & Mfg Directorate, Soft Matter Branch, Wright Patterson AFB, OH 45433 USA
UES Inc, Dayton, OH 45432 USAAir Force Res Lab, Mat & Mfg Directorate, Soft Matter Branch, Wright Patterson AFB, OH 45433 USA
Kohlmeyer, Ryan R.
Hardin, James O.
论文数: 0引用数: 0
h-index: 0
机构:
Air Force Res Lab, Mat & Mfg Directorate, Soft Matter Branch, Wright Patterson AFB, OH 45433 USA
UES Inc, Dayton, OH 45432 USAAir Force Res Lab, Mat & Mfg Directorate, Soft Matter Branch, Wright Patterson AFB, OH 45433 USA
Hardin, James O.
Carmona, Eric A.
论文数: 0引用数: 0
h-index: 0
机构:
Air Force Res Lab, Mat & Mfg Directorate, Soft Matter Branch, Wright Patterson AFB, OH 45433 USA
Univ Minnesota, Dept Chem Engn & Mat Sci, Minneapolis, MN 55455 USAAir Force Res Lab, Mat & Mfg Directorate, Soft Matter Branch, Wright Patterson AFB, OH 45433 USA
Carmona, Eric A.
Maruyama, Benji
论文数: 0引用数: 0
h-index: 0
机构:
Air Force Res Lab, Mat & Mfg Directorate, Soft Matter Branch, Wright Patterson AFB, OH 45433 USAAir Force Res Lab, Mat & Mfg Directorate, Soft Matter Branch, Wright Patterson AFB, OH 45433 USA
Maruyama, Benji
Berrigan, John Daniel
论文数: 0引用数: 0
h-index: 0
机构:
Air Force Res Lab, Mat & Mfg Directorate, Soft Matter Branch, Wright Patterson AFB, OH 45433 USAAir Force Res Lab, Mat & Mfg Directorate, Soft Matter Branch, Wright Patterson AFB, OH 45433 USA
Berrigan, John Daniel
Huang, Hong
论文数: 0引用数: 0
h-index: 0
机构:
Wright State Univ, Dept Mech & Mat Engn, Dayton, OH 45435 USAAir Force Res Lab, Mat & Mfg Directorate, Soft Matter Branch, Wright Patterson AFB, OH 45433 USA
Huang, Hong
Durstock, Michael F.
论文数: 0引用数: 0
h-index: 0
机构:
Air Force Res Lab, Mat & Mfg Directorate, Soft Matter Branch, Wright Patterson AFB, OH 45433 USAAir Force Res Lab, Mat & Mfg Directorate, Soft Matter Branch, Wright Patterson AFB, OH 45433 USA
机构:
Iowa State Univ, Dept Mech Engn, Ames, IA 50010 USAIowa State Univ, Dept Mech Engn, Ames, IA 50010 USA
Gamba, Livio
Johnson, Zachary T.
论文数: 0引用数: 0
h-index: 0
机构:
Iowa State Univ, Dept Mech Engn, Ames, IA 50010 USAIowa State Univ, Dept Mech Engn, Ames, IA 50010 USA
Johnson, Zachary T.
Atterberg, Jackie
论文数: 0引用数: 0
h-index: 0
机构:
Iowa State Univ, Dept Mech Engn, Ames, IA 50010 USAIowa State Univ, Dept Mech Engn, Ames, IA 50010 USA
Atterberg, Jackie
Diaz-Arauzo, Santiago
论文数: 0引用数: 0
h-index: 0
机构:
Northwestern Univ, Dept Mat Sci & Engn, Evanston, IL 60208 USAIowa State Univ, Dept Mech Engn, Ames, IA 50010 USA
Diaz-Arauzo, Santiago
Downing, Julia R.
论文数: 0引用数: 0
h-index: 0
机构:
Northwestern Univ, Dept Mat Sci & Engn, Evanston, IL 60208 USAIowa State Univ, Dept Mech Engn, Ames, IA 50010 USA
Downing, Julia R.
Claussen, Jonathan C.
论文数: 0引用数: 0
h-index: 0
机构:
Iowa State Univ, Dept Mech Engn, Ames, IA 50010 USAIowa State Univ, Dept Mech Engn, Ames, IA 50010 USA
Claussen, Jonathan C.
Hersam, Mark C.
论文数: 0引用数: 0
h-index: 0
机构:
Northwestern Univ, Dept Mat Sci & Engn, Dept Chem, Evanston, IL 60208 USA
Northwestern Univ, Dept Elect & Comp Engn, Evanston, IL 60208 USAIowa State Univ, Dept Mech Engn, Ames, IA 50010 USA
Hersam, Mark C.
Secor, Ethan B.
论文数: 0引用数: 0
h-index: 0
机构:
Iowa State Univ, Dept Mech Engn, Ames, IA 50010 USAIowa State Univ, Dept Mech Engn, Ames, IA 50010 USA
机构:
Carnegie Mellon Univ, Dept Mech Engn, Pittsburgh, PA 15213 USACarnegie Mellon Univ, Dept Mech Engn, Pittsburgh, PA 15213 USA
Hu, Chunshan
Yuan, Bin
论文数: 0引用数: 0
h-index: 0
机构:
Carnegie Mellon Univ, Dept Mech Engn, Pittsburgh, PA 15213 USACarnegie Mellon Univ, Dept Mech Engn, Pittsburgh, PA 15213 USA
Yuan, Bin
Jahan, Sanjida
论文数: 0引用数: 0
h-index: 0
机构:
Carnegie Mellon Univ, Dept Mech Engn, Pittsburgh, PA 15213 USACarnegie Mellon Univ, Dept Mech Engn, Pittsburgh, PA 15213 USA
Jahan, Sanjida
论文数: 引用数:
h-index:
机构:
Saleh, Mohammad S.
Guo, Zhitao
论文数: 0引用数: 0
h-index: 0
机构:
Carnegie Mellon Univ, Dept Chem Engn, Pittsburgh, PA 15213 USA
Carnegie Mellon Univ, Wilton E Scott Inst Energy Innovat, Pittsburgh, PA 15213 USACarnegie Mellon Univ, Dept Mech Engn, Pittsburgh, PA 15213 USA
Guo, Zhitao
Gellman, Andrew J.
论文数: 0引用数: 0
h-index: 0
机构:
Carnegie Mellon Univ, Dept Chem Engn, Pittsburgh, PA 15213 USA
Carnegie Mellon Univ, Wilton E Scott Inst Energy Innovat, Pittsburgh, PA 15213 USACarnegie Mellon Univ, Dept Mech Engn, Pittsburgh, PA 15213 USA
机构:
Harvard Univ, Rowland Inst, Cambridge, MA 02142 USA
Swiss Fed Inst Technol, Dept Civil Environm & Geomat Engn, Inst Environm Engn, Environm Microfluid Grp, CH-8093 Zurich, SwitzerlandIntel Corp, Technol Dev Grp, Hillsboro, OR 97124 USA
Baumgartner, Dieter A.
论文数: 引用数:
h-index:
机构:
Shiri, Samira
Sinha, Shayandev
论文数: 0引用数: 0
h-index: 0
机构:
Intel Corp, Technol Dev Grp, Hillsboro, OR 97124 USA
Harvard Univ, Rowland Inst, Cambridge, MA 02142 USAIntel Corp, Technol Dev Grp, Hillsboro, OR 97124 USA
Sinha, Shayandev
Karpitschka, Stefan
论文数: 0引用数: 0
h-index: 0
机构:
Max Planck Inst Dynam & Self Org, D-37077 Gottingen, GermanyIntel Corp, Technol Dev Grp, Hillsboro, OR 97124 USA
Karpitschka, Stefan
Cira, Nate J.
论文数: 0引用数: 0
h-index: 0
机构:
Harvard Univ, Rowland Inst, Cambridge, MA 02142 USA
Cornell Univ, Dept Biomed Engn, Ithaca, NY 14850 USAIntel Corp, Technol Dev Grp, Hillsboro, OR 97124 USA
机构:
Air Force Res Lab, Mat & Mfg Directorate, Soft Matter Branch, Wright Patterson AFB, OH 45433 USA
Wright State Univ, Dept Mech & Mat Engn, Dayton, OH 45435 USAAir Force Res Lab, Mat & Mfg Directorate, Soft Matter Branch, Wright Patterson AFB, OH 45433 USA
Blake, Aaron J.
Kohlmeyer, Ryan R.
论文数: 0引用数: 0
h-index: 0
机构:
Air Force Res Lab, Mat & Mfg Directorate, Soft Matter Branch, Wright Patterson AFB, OH 45433 USA
UES Inc, Dayton, OH 45432 USAAir Force Res Lab, Mat & Mfg Directorate, Soft Matter Branch, Wright Patterson AFB, OH 45433 USA
Kohlmeyer, Ryan R.
Hardin, James O.
论文数: 0引用数: 0
h-index: 0
机构:
Air Force Res Lab, Mat & Mfg Directorate, Soft Matter Branch, Wright Patterson AFB, OH 45433 USA
UES Inc, Dayton, OH 45432 USAAir Force Res Lab, Mat & Mfg Directorate, Soft Matter Branch, Wright Patterson AFB, OH 45433 USA
Hardin, James O.
Carmona, Eric A.
论文数: 0引用数: 0
h-index: 0
机构:
Air Force Res Lab, Mat & Mfg Directorate, Soft Matter Branch, Wright Patterson AFB, OH 45433 USA
Univ Minnesota, Dept Chem Engn & Mat Sci, Minneapolis, MN 55455 USAAir Force Res Lab, Mat & Mfg Directorate, Soft Matter Branch, Wright Patterson AFB, OH 45433 USA
Carmona, Eric A.
Maruyama, Benji
论文数: 0引用数: 0
h-index: 0
机构:
Air Force Res Lab, Mat & Mfg Directorate, Soft Matter Branch, Wright Patterson AFB, OH 45433 USAAir Force Res Lab, Mat & Mfg Directorate, Soft Matter Branch, Wright Patterson AFB, OH 45433 USA
Maruyama, Benji
Berrigan, John Daniel
论文数: 0引用数: 0
h-index: 0
机构:
Air Force Res Lab, Mat & Mfg Directorate, Soft Matter Branch, Wright Patterson AFB, OH 45433 USAAir Force Res Lab, Mat & Mfg Directorate, Soft Matter Branch, Wright Patterson AFB, OH 45433 USA
Berrigan, John Daniel
Huang, Hong
论文数: 0引用数: 0
h-index: 0
机构:
Wright State Univ, Dept Mech & Mat Engn, Dayton, OH 45435 USAAir Force Res Lab, Mat & Mfg Directorate, Soft Matter Branch, Wright Patterson AFB, OH 45433 USA
Huang, Hong
Durstock, Michael F.
论文数: 0引用数: 0
h-index: 0
机构:
Air Force Res Lab, Mat & Mfg Directorate, Soft Matter Branch, Wright Patterson AFB, OH 45433 USAAir Force Res Lab, Mat & Mfg Directorate, Soft Matter Branch, Wright Patterson AFB, OH 45433 USA
机构:
Iowa State Univ, Dept Mech Engn, Ames, IA 50010 USAIowa State Univ, Dept Mech Engn, Ames, IA 50010 USA
Gamba, Livio
Johnson, Zachary T.
论文数: 0引用数: 0
h-index: 0
机构:
Iowa State Univ, Dept Mech Engn, Ames, IA 50010 USAIowa State Univ, Dept Mech Engn, Ames, IA 50010 USA
Johnson, Zachary T.
Atterberg, Jackie
论文数: 0引用数: 0
h-index: 0
机构:
Iowa State Univ, Dept Mech Engn, Ames, IA 50010 USAIowa State Univ, Dept Mech Engn, Ames, IA 50010 USA
Atterberg, Jackie
Diaz-Arauzo, Santiago
论文数: 0引用数: 0
h-index: 0
机构:
Northwestern Univ, Dept Mat Sci & Engn, Evanston, IL 60208 USAIowa State Univ, Dept Mech Engn, Ames, IA 50010 USA
Diaz-Arauzo, Santiago
Downing, Julia R.
论文数: 0引用数: 0
h-index: 0
机构:
Northwestern Univ, Dept Mat Sci & Engn, Evanston, IL 60208 USAIowa State Univ, Dept Mech Engn, Ames, IA 50010 USA
Downing, Julia R.
Claussen, Jonathan C.
论文数: 0引用数: 0
h-index: 0
机构:
Iowa State Univ, Dept Mech Engn, Ames, IA 50010 USAIowa State Univ, Dept Mech Engn, Ames, IA 50010 USA
Claussen, Jonathan C.
Hersam, Mark C.
论文数: 0引用数: 0
h-index: 0
机构:
Northwestern Univ, Dept Mat Sci & Engn, Dept Chem, Evanston, IL 60208 USA
Northwestern Univ, Dept Elect & Comp Engn, Evanston, IL 60208 USAIowa State Univ, Dept Mech Engn, Ames, IA 50010 USA
Hersam, Mark C.
Secor, Ethan B.
论文数: 0引用数: 0
h-index: 0
机构:
Iowa State Univ, Dept Mech Engn, Ames, IA 50010 USAIowa State Univ, Dept Mech Engn, Ames, IA 50010 USA