Electrochemical behavior of ECAP-processed Sn-5Sb alloy

被引:3
作者
Alipour, S. [1 ]
Vafaeenezhad, H. [2 ]
Fesahat, M. [2 ]
Yazdi, A. [2 ]
Mousavi-Khoshdel, S. M. [1 ]
Soltanieh, M. [2 ]
机构
[1] Iran Univ Sci & Technol IUST, Dept Chem, Tehran, Iran
[2] Iran Univ Sci & Technol, Sch Met & Mat Engn, Cent Reference Lab CRL, Tehran, Iran
来源
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T | 2023年 / 23卷
关键词
Sn-5Sb alloy; Equal channel angular pressing; Electrochemical behavior; Mott -Schottky study; Passive film; SEVERE PLASTIC-DEFORMATION; MECHANICAL-PROPERTIES; PASSIVE FILM; CORROSION-RESISTANCE; SEMICONDUCTING BEHAVIOR; PURE COPPER; MICROSTRUCTURE; EVOLUTION; STEEL; TIN;
D O I
10.1016/j.jmrt.2023.02.128
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
An attempt has been made in this research to evaluate the effects of severe plastic deformation (SPD) on the electrochemical and passivation response of Sn-5Sb alloy. The electrochemical response of severely deformed alloy through the equal channel angular pressing (ECAP) process has been studied by cyclic voltammetry (CV), potentiodynamic polarization (PDP), electrochemical impedance spectroscopy (EIS), and Mott-Schottky in 0.1 M NaOH solution. The grain structure and corrosion product of samples have been evaluated by X-ray diffraction (XRD), atomic force microscopy (AFM) patterns, trans-mission electron microscopy (TEM), and field emission scanning electron (FESEM) micro-graphs. It has been revealed that imposing such a large strain yields specimens with finer grain structure resulting in higher corrosion resistance and higher protecting passive films.(c) 2023 The Author(s). Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).
引用
收藏
页码:5193 / 5211
页数:19
相关论文
共 78 条
[1]  
A. International, 2013, E11213 A INT
[2]   Microstructural characterization and enhanced tensile and tribological properties of Cu-SiC nanocomposites developed by high-pressure torsion [J].
Akbarpour, M. R. ;
Asl, F. Gharibi ;
Mirabad, H. Mousa ;
Kim, H. S. .
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, 2022, 20 :4038-4051
[3]  
Al-Deen H, 2020, J MECH ENG RES DEV, V43, P218
[4]   Grain boundary diffusion and recrystallization in ultrafine grain copper produced by equal channel angular pressing [J].
Amouyal, Y. ;
Divinski, S. V. ;
Klinger, L. ;
Rabkin, E. .
ACTA MATERIALIA, 2008, 56 (19) :5500-5513
[5]   Effects of grain size on the corrosion resistance of wrought magnesium alloys containing neodymium [J].
Argade, G. R. ;
Panigrahi, S. K. ;
Mishra, R. S. .
CORROSION SCIENCE, 2012, 58 :145-151
[6]  
Ataei H, 2021, MET MATER INT, V27, P676
[7]   A study on microstructure development and mechanical properties of pure copper subjected to severe plastic deformation by the ECAP-Conform process [J].
Atefi, S. ;
Parsa, M. H. ;
Ahmadkhaniha, D. ;
Zanella, C. ;
Jafarian, H. R. .
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, 2022, 21 :1614-1629
[8]   Modeling of electrochemical oxide film growth-a PDM refinement [J].
Bosing, Ingmar ;
La Mantia, Fabio ;
Thoming, Jorg .
ELECTROCHIMICA ACTA, 2022, 406
[9]   POTENTIODYNAMIC CURRENT/POTENTIAL RELATIONS FOR FILM FORMATION UNDER OHMIC RESISTANCE CONTROL [J].
CALANDRA, AJ ;
DETACCONI, NR ;
PEREIRO, R ;
ARVIA, AJ .
ELECTROCHIMICA ACTA, 1974, 19 (12) :901-905
[10]  
Cotton F.A., 1988, ADV INORG CHEM, Vfifth