Time-dependent Bulk Behavior of Cured Epoxy Molding Compound

被引:1
作者
Phansalkar, Sukrut Prashant [1 ]
Mittakolu, Roshith [1 ]
Han, Bongtae [1 ]
机构
[1] Univ Maryland, Dept Mech Engn, College Pk, MD 20742 USA
来源
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC | 2023年
关键词
Epoxy Molding Compound (EMC); viscoelastic bulk behavior; cure-dependent bulk behavior; COMPRESSIBILITY;
D O I
10.1109/ECTC51909.2023.00358
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A unique hydrostatic testing setup to measure time-and-temperature dependent hydrostatic strains of EMC is developed and implemented. The setup can apply hydrostatic pressure to an EMC coupon at any preset rates at a wide range of temperatures using He gas. In this study, a linear ramp of pressure application is employed to avoid heat generation associated with instant pressure application used in the previous attempt. The time-and-temperature dependent bulk moduli are determined by solving the hereditary integral equation using the pressure and hydrostatic strain history document during testing. This procedure requires a short testing time, which is ideally suited to measurements of the viscoelastic bulk behavior of partially cured EMC.
引用
收藏
页码:2093 / 2100
页数:8
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