A modular and scalable system for electromagnetic compatibility testing of integrated circuits

被引:0
|
作者
Kircher, Daniel [1 ]
Profanter, Simon [1 ]
Deutschmann, Bernd [1 ]
机构
[1] Graz Univ Technol, Inst Elect IFE, Inffeldgasse 12, A-8010 Graz, Austria
来源
ELEKTROTECHNIK UND INFORMATIONSTECHNIK | 2024年 / 141卷 / 01期
关键词
Integrated circuit (IC); Electromagnetic compatibility (EMC); Modular test system; Radio frequency (RF); Reusable; Integrierte Schaltungen (IC); Elektromagnetische Vertraglichkeit (EMV); Modulares Testsystem; Hochfrequenz (HF); Wiederverwendbar;
D O I
10.1007/s00502-023-01199-1
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
To bring automotive integrated circuits (ICs) to market, manufacturers must subject their products to numerous electromagnetic compatibility (EMC) tests such as electromagnetic immunity and emission tests, or electrostatic discharge (ESD) tests. These tests need EMC test boards that meet the requirements of the specific standards. However, the current need to increase the frequency range of EMC tests poses a challenge in designing standard-compliant test boards. In this paper, we address this issue by introducing a modular and reusable IC level EMC test system. We demonstrate the system's effectiveness with an example of two frequently used and conducted EMC tests: the direct power injection (DPI) immunity test and the 150 omega\documentclass[12pt]{minimal} \usepackage{amsmath} \usepackage{wasysym} \usepackage{amsfonts} \usepackage{amssymb} \usepackage{amsbsy} \usepackage{mathrsfs} \usepackage{upgreek} \setlength{\oddsidemargin}{-69pt} \begin{document}$$150\,\mathrm{\Omega}$$\end{document} electromagnetic emission measurement. The two test setups are constructed and validated using the presented modules. It is shown how the frequency range can be expanded while minimizing costs and design efforts for the EMC test board design. Um integrierte Schaltungen (ICs) fur Kraftfahrzeuge auf den Markt bringen zu konnen, mussen die Hersteller ihre Produkte zahlreichen Tests zur elektromagnetischen Vertraglichkeit (EMV) unterziehen, wie z. B. Tests zur elektromagnetischen Immunitat und Storaussendung oder Tests zur elektrostatischen Entladung (ESD). Fur diese Tests werden EMV-Testboards benotigt, die den Anforderungen der spezifischen Normen entsprechen. Die Erweiterung des Frequenzbereichs fur EMV-Tests stellt eine Herausforderung fur die Entwicklung normgerechter Testboards dar. In diesem Beitrag wird dieses Problem durch die Einfuhrung eines modularen und wiederverwendbaren EMV-Testsystems auf IC-Ebene gelost. Wir demonstrieren die Performance des Systems am Beispiel von zwei haufig verwendeten EMV-Tests: dem Direct Power Injection(DPI)-Storfestigkeitstest und der 150 omega\documentclass[12pt]{minimal} \usepackage{amsmath} \usepackage{wasysym} \usepackage{amsfonts} \usepackage{amssymb} \usepackage{amsbsy} \usepackage{mathrsfs} \usepackage{upgreek} \setlength{\oddsidemargin}{-69pt} \begin{document}$${\mathrm{\Omega}}$$\end{document}-Messung der elektromagnetischen Storaussendung. Beide Testaufbauten werden mit den vorgestellten Modulen aufgebaut und validiert. Es wird gezeigt, wie der Frequenzbereich bei gleichzeitiger Minimierung der Kosten und des Entwicklungsaufwands fur die EMV-Testplatine erweitert werden kann.
引用
收藏
页码:47 / 55
页数:9
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