On-Chip Terahertz antenna array based on amalgamation of metasurface-inspired and artificial magnetic conductor technologies for next generation of wireless electronic devices

被引：7
作者：
Alibakhshikenari, Mohammad [1 ]
Virdee, Bal S. [2 ]
Salekzamankhani, Shahram [2 ]
Babaeian, Fatemeh [3 ]
Ali, Syed Mansoor [4 ]
Iqbal, Amjad [5 ,6 ]
Al-Hasan, Muath [6 ]
机构：
[1] Univ Carlos III Madrid, Dept Signal Theory & Commun, Madrid 28911, Spain
[2] London Metropolitan Univ, Ctr Commun Technol, London N7 8DB, England
[3] Monash Univ, Dept Elect & Comp Syst Engn, Melbourne, Vic 3800, Australia
[4] King Saud Univ, Coll Sci, Dept Phys & Astron, POB 2455, Riyadh 11451, Saudi Arabia
[5] Inst Natl Rech Sci INRS, Montreal, PQ H5A 1K6, Canada
[6] Al Ain Univ, Dept Network & Commun Engn, Al Ain 64141, U Arab Emirates
来源：
AEU-INTERNATIONAL JOURNAL OF ELECTRONICS AND COMMUNICATIONS | 2023年 / 167卷
关键词：
On-chip antenna array; Metasurface (MTS); Millimeter-waves (mm-Wave); Terahertz (THz); Integrated circuit (IC); Artificial magnetic conductor (AMC) technology; RF front-end transceiver; Low noise amplifier (LNA); Next generation of wireless communications; Electronic devices; INTEGRATED ANTENNA; LOW-COST; CMOS; GAIN; TRANSCEIVER; RECEIVER; DESIGN; GHZ; SURFACES; SYSTEM;
D O I：
10.1016/j.aeue.2023.154684
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The paper presents a feasibility study on an innovative terahertz (THz) on-chip antenna array designed to reliably meet the high-performance connectivity requirements for next generation of wireless devices to enable bandwidth intensive applications, superfast fast streaming, bulk data exchange between internet of things (IoT) devices/smartphones and the development of holographic video conferencing. The significantly smaller wavelength of the THz-band and metasurface-inspired and artificial magnetic conductor (AMC) technologies are exploited here to realize an on-chip antenna. Several experimental on-chip antenna arrays of various matrix sizes were investigated for application at millimeter-wave/Terahertz RF front-end transceivers. The technique proposed here is shown to enhance the antennas impedance bandwidth, gain and radiation efficiency. Purely for experimental purposes a 2 x 24 radiation element array was fabricated. It exhibits an average measured gain of 20.36 dBi and radiation efficiency of 37.5% across 0.3-0.314 THz. For proof of the concept purposes a THz receiver incorporating the proposed on-chip antenna was modelled. The results show that with the proposed antenna array a THz receiver can provide a gain of 25 dB when the antenna is directly matched to low-noise amplifier stage.
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页数：14
相关论文
共 55 条
  • [31] 340-GHz Low-Cost and High-Gain On-Chip Higher Order Mode Dielectric Resonator Antenna for THz Applications
    Li, Chun-Hsing
    Chiu, Te-Yen
    [J]. IEEE TRANSACTIONS ON TERAHERTZ SCIENCE AND TECHNOLOGY, 2017, 7 (03) : 284 - 294
  • [32] Integrated Millimeter-Wave On-Chip Antenna Design Employing Artificial Magnetic Conductor
    Lin, Fujiang
    Ooi, Ban Leong
    [J]. 2009 IEEE INTERNATIONAL SYMPOSIUM ON RADIO-FREQUENCY INTEGRATION TECHNOLOGY: SYNERGY OF RF AND IC TECHNOLOGIES, PROCEEDINGS, 2009, : 174 - 177
  • [33] On-wafer measurement setups for on-chip antennas fabricated on silicon substrates
    Lin, JJ
    Sugavanam, A
    Li, G
    Brewer, JE
    Kenneth, KO
    [J]. Digital Communications Systems Metrics, 2004, : 221 - 225
  • [34] Murdock J., 2011, IEEE MTT S INT MICR, P1, DOI [10.1109/MWSYM.2011.5972965, DOI 10.1109/MWSYM.2011.5972965]
  • [35] Nafe M, 2015, 2015 9TH EUROPEAN CONFERENCE ON ANTENNAS AND PROPAGATION (EUCAP)
  • [36] Nicolson ST, 2008, IEEE RAD FREQ INTEGR, P203
  • [37] A Fully Integrated IEEE 802.15.4g MR-FSK SoC for Smart Utility Network Applications
    Oh, Mi-Kyung
    Kim, Jae-Young
    Lee, Sangjae
    Jeon, Youngae
    Choi, Sangsung
    [J]. IEEE TRANSACTIONS ON CONSUMER ELECTRONICS, 2014, 60 (04) : 580 - 586
  • [38] Implementation of packaged integrated antenna with embedded front end for Bluetooth applications
    Rotaru, Mihai
    Ying, Lim Ying
    Kuruveettil, Haridas
    Rui, Yang
    Popov, Alexander P.
    Chee-Parng, Chua
    [J]. IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2008, 31 (03): : 558 - 567
  • [39] Design and performance of a 60-GHz multi-chip module receiver employing substrate integrated waveguides
    Samanta, K. K.
    Stephens, D.
    Robertson, I. D.
    [J]. IET MICROWAVES ANTENNAS & PROPAGATION, 2007, 1 (05) : 961 - 967
  • [40] Sankaran S., 2009, P IEEE INT SOL STAT, P202
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