Mobile Measurement of a Dynamic Field via Compressed Sensing

被引:1
作者
Li, Tianwei [1 ]
Zou, Qingze [2 ]
机构
[1] Rutgers State Univ, Dept Elect & Comp Engn, Piscataway, NJ 08854 USA
[2] Rutgers State Univ, Dept Mech & Aerosp Engn, Piscataway, NJ 08854 USA
关键词
Sensors; Time measurement; Aerodynamics; Costs; Sea measurements; Mobile agents; Position measurement; Mobile sensing; dynamics mapping; compressed sensing; simulated annealing optimization; atomic force microscopy; COVERAGE CONTROL; TOPOGRAPHY; RESOLUTION; RECOVERY; SPARSITY;
D O I
10.1109/TMC.2021.3125201
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
In this paper, measuring dynamic signals at points of interest (POIs) using a mobile agent is considered, where the agent is required to repeatedly measure at and transit between the POIs. Dynamic field sensing is needed in areas ranging from nanomechanical mapping of live sample to crop monitoring. Existing work on mobile sensing, however, has been focused on cooperatively tracking one or few known or unknown POIs, whereas the dynamics of the signals is ignored. Challenges arise from capturing and recovering the dynamics at each POI by using the data intermittently measured by the mobile agent, resulting in temporal-spatial coupling in mobile sensing. Moreover, trade off between the sensing cost and the performance needs to be addressed. We propose a compressed-sensing based approach to tackle this problem. First, a check-and-removal process based on random permutation and partition of the measurement periods is developed to avoid the temporal-spatial coupling under the agent speed constraint. Then a shuffle-and-pair process based on the simulate-annealing is proposed to minimize the transition distance while preserving the performance. It is shown that the distribution of the measurement periods between the POIs converges. The proposed approach is illustrated through a simulation study of measuring the temperature-dependent nanomechanical variations of a polymer sample.
引用
收藏
页码:2802 / 2817
页数:16
相关论文
共 50 条
[31]   MULTICHANNEL COMPRESSED SENSING VIA SOURCE SEPARATION FOR HYPERSPECTRAL IMAGES [J].
Golbabaee, Mohammad ;
Arberet, Simon ;
Vandergheynst, Pierre .
18TH EUROPEAN SIGNAL PROCESSING CONFERENCE (EUSIPCO-2010), 2010, :1326-1329
[32]   Super-resolution ghost imaging via compressed sensing [J].
Li Long-Zhen ;
Yao Xu-Ri ;
Liu Xue-Feng ;
Yu Wen-Kai ;
Zhai Guang-Jie .
ACTA PHYSICA SINICA, 2014, 63 (22) :224201
[33]   Image compressed sensing recovery via nonconvex garrote regularization [J].
Keshavarzian, Razieh ;
Aghagolzadeh, Ali ;
Rezaii, Tohid Yousefi .
MULTIMEDIA TOOLS AND APPLICATIONS, 2019, 78 (16) :22301-22323
[34]   Deformation Corrected Compressed Sensing (DC-CS): A Novel Framework for Accelerated Dynamic MRI [J].
Lingala, Sajan Goud ;
DiBella, Edward ;
Jacob, Mathews .
IEEE TRANSACTIONS ON MEDICAL IMAGING, 2015, 34 (01) :72-85
[35]   Fast Reconstruction of Sensing Matrices for Compressed Sensing in Computational Microwave Imaging Systems With Metasurface Apertures [J].
Fu, Haosheng ;
Dai, Fengzhou ;
Xu, Hong ;
Jiang, Junzheng ;
Quan, Yinghui .
IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, 2025, 74
[36]   Measurement Bounds for Compressed Sensing with Missing Data [J].
Joseph, Geethu ;
Varshney, Pramod K. .
PROCEEDINGS OF THE 21ST IEEE INTERNATIONAL WORKSHOP ON SIGNAL PROCESSING ADVANCES IN WIRELESS COMMUNICATIONS (IEEE SPAWC2020), 2020,
[37]   Surface Measurement Using Compressed Wavefront Sensing [J].
Eddy Mun Tik Chow ;
Ningqun Guo ;
Edwin Chong ;
Xin Wang .
Photonic Sensors, 2019, 9 :115-125
[38]   Surface Measurement Using Compressed Wavefront Sensing [J].
Chow, Eddy Mun Tik ;
Guo, Ningqun ;
Chong, Edwin ;
Wang, Xin .
PHOTONIC SENSORS, 2019, 9 (02) :115-125
[39]   High-Frequency Subpixel Vibration Measurement Based on Compressed Sensing [J].
Li, Xingjian ;
Zhang, Yuedong ;
Wen, Gaojin ;
Zhang, Xuguo ;
Wu, Limin .
IEEE SENSORS JOURNAL, 2025, 25 (11) :19662-19669
[40]   A simple measurement matrix for compressed sensing of synthetic aperture ultrasound imaging [J].
Wang, Linhong ;
Kong, Lu ;
Wang, Ping .
INTERNATIONAL JOURNAL OF EMBEDDED SYSTEMS, 2022, 15 (03) :270-278