A review of diamond interfacial modification and its effect on the properties of diamond/Cu matrix composites

被引：38

作者：

Zhou, Lianggong ^{[1
]}

Liu, Jianan ^{[1
]}

Ding, Ruiqing ^{[1
]}

Cao, Jiaming ^{[1
]}

Zhan, Ke ^{[1
]}

Zhao, Bin ^{[1
]}

机构：

[1] Univ Shanghai Sci & Technol, Sch Mat & Chem, Shanghai, Peoples R China

来源：

SURFACES AND INTERFACES | 2023年 / 40卷

基金：

上海市自然科学基金; 中国国家自然科学基金;

关键词：

Diamond; cu matrix composites; Interface modification; High solid -solution modified elements; Low solid -solution modified elements; Thermal conductivity; HIGH THERMAL-CONDUCTIVITY; MECHANICAL-PROPERTIES; COATED DIAMOND; CU/DIAMOND COMPOSITES; COPPER COMPOSITES; DIAMOND/ALUMINUM COMPOSITES; CU COMPOSITES; CARBIDE LAYER; CVD DIAMOND; PARTICLES;

D O I：

10.1016/j.surfin.2023.103143

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

Diamond/Cu composites have great potential applications in thermal management for its high thermal conductivity (TC), low expansion, good heat and corrosion resistance. However, the weak interfacial bonding between diamond and Cu often deteriorates its properties and interface modification design is considered as an effective way to improve its interface strength and reduce its thermal resistance. In this paper, interface modifying elements were divided into low solid-solution elements and high solid-solution elements according to their solubility in the copper matrix, and the effects of different elements on TC of diamond/Cu composites are discussed. Then, the theoretical models of the TC mechanism of diamond/Cu matrix composites are analyzed. Finally, the future development direction and possible challenges are summarized.

引用

页数：16

共 90 条

[1] Mechanical properties of a diamond-copper composite with high thermal conductivity [J].

Abyzov, Andrey M. ;

Shakhov, Fedor M. ;

Averkin, Andrey I. ;

Nikolaev, Vladimir I. .

MATERIALS & DESIGN, 2015, 87 :527-539

[2] Diamond-tungsten based coating-copper composites with high thermal conductivity produced by Pulse Plasma Sintering [J].

Abyzov, Andrey M. ;

Kruszewski, Miroslaw J. ;

Ciupinski, Lukasz ;

Mazurkiewicz, Marta ;

Michalski, Andrzej ;

Kurzydlowski, Krzysztof J. .

MATERIALS & DESIGN, 2015, 76 :97-109

[3] High thermal conductivity composites consisting of diamond filler with tungsten coating and copper (silver) matrix [J].

Abyzov, Andrey M. ;

Kidalov, Sergey V. ;

Shakhov, Fedor M. .

JOURNAL OF MATERIALS SCIENCE, 2011, 46 (05) :1424-1438

[4] High thermal conductivity of Cu-B/diamond composites prepared by gas pressure infiltration [J].

Bai, Guangzhu ;

Li, Ning ;

Wang, Xitao ;

Wang, Jinguo ;

Kim, Moon J. ;

Zhang, Hailong .

JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 735 :1648-1653

[5] Thermal conductivity of Cu/diamond composites prepared by a new pretreatment of diamond powder [J].

Bai, Hua ;

Ma, Nangang ;

Lang, Jing ;

Zhu, Congxu ;

Ma, Yi .

COMPOSITES PART B-ENGINEERING, 2013, 52 :182-186

[6] Interface formation in infiltrated Al(Si)/diamond composites [J].

Beffort, O. ;

Khalid, F. A. ;

Weber, L. ;

Ruch, P. ;

Klotz, U. E. ;

Meier, S. ;

Kleiner, S. .

[7] Thermal expansion coefficients of Ag, Cu and diamond nanoparticles: In situ TEM diffraction and EELS measurements [J].

Bogatyrenko, S. ;

Kryshtal, A. .

MATERIALS CHARACTERIZATION, 2021, 178

[8] Mo-interlayer-mediated thermal conductance at Cu/diamond interface measured by time-domain thermoreflectance [J].

Chang, Guo ;

Sun, Fangyuan ;

Wang, Luhua ;

Zhang, Yin ;

Wang, Xitao ;

Wang, Jinguo ;

Kim, Moon J. ;

Zhang, Hailong .

COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2020, 135

[9] Effect of Ti interlayer on interfacial thermal conductance between Cu and diamond [J].

Chang, Guo ;

Sun, Fangyuan ;

Duan, Jialiang ;

Che, Zifan ;

Wang, Xitao ;

Wang, Jinguo ;

Kim, Moon J. ;

Zhang, Hailong .

ACTA MATERIALIA, 2018, 160 :235-246

[10] Spark plasma sintering of titanium-coated diamond and copper-titanium powder to enhance thermal conductivity of diamond/copper composites [J].

Che, Q. L. ;

Zhang, J. J. ;

Chen, X. K. ;

Ji, Y. Q. ;

Li, Y. W. ;

Wang, L. X. ;

Cao, S. Z. ;

Guo, L. ;

Wang, Z. ;

Wang, S. W. ;

Zhang, Z. K. ;

Jiang, Y. G. .

MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2015, 33 :67-75

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