Studies of the Thermal Conductivity and Thermal Resistance of Solder Layers with Lead-Free Pastes by the Photodeflection Method

被引：0
作者：
Glazov, A. L. [1 ]
Kalinovskii, V. S. [1 ]
Kontrosh, E. V. [1 ]
Muratikov, K. L. [1 ]
机构：
[1] Ioffe Inst, St Petersburg, Russia
来源：
TECHNICAL PHYSICS LETTERS | 2023年 / 49卷 / 12期
关键词：
thermal resistance; multi-junction solar cells; lead-free solder; non-destructive testing; thermal waves; CELLS; WAVE;
D O I：
10.1134/S1063785023900200
中图分类号：
O59 [应用物理学];
学科分类号：
摘要：
The processes of heat removal from multijunction solar cells on a germanium substrate to AlN ceramics through a solder layer were studied by thermal wave photodeflection methods. Two types lead-free solder based on SnBi and SnAgCu were used under various pressure soldering conditions. The thermal conductivity and thermal resistance of the solder layers are compared. It is shown that the thermal conductivities of the solder layers differ from the reference data for the corresponding metal alloys, and in some cases may depend on the pressure during the brazing process.
引用
收藏
页码：265 / 268
页数：4
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