Influence of Isocyanate Content and Hot-Pressing Temperatures on the Physical-Mechanical Properties of Particleboard Bonded with a Hybrid Urea-Formaldehyde/Isocyanate Adhesive

Particleboard (PB) is mainly produced using urea-formaldehyde (UF) adhesive. However, the low hydrolytic stability of UF leads to poor water resistance by the PB. This research aimed to analyze the effect of hot-pressing temperatures and the addition of methylene diphenyl diisocyanate (MDI) in UF adhesive on the physical and mechanical properties of PB. The first experiment focused on pressing temperature treatments including 130, 140, 150, and 160 degrees C. The particles were bonded using a combination of UF and MDI resin at a ratio of 70/30 (%w/w). Furthermore, the second experiment focused on UF/MDI ratio treatment, including 100/0, 85/15, 70/30, and 55/45 (%w/w), and the particles were pressed at 140 degrees C. All of the single-layer particleboard in this research were produced in 250 x 250 mm, with a target thickness and density of 10 mm and 750 kg/m(3), respectively. This research used 12% resin content based on oven-dry weight wood shaving. The pressing time and pressing pressure were determined to be 10 min and 2.5 N/mm(2), respectively. Before the tests, the board was conditioned for 7 days. When studying the effect of treatment temperature, good physical properties (thickness swelling and water absorption) and mechanical properties (MOR and MOE) were obtained at 140 degrees C. However, no significant difference was observed in the UF/MDI ratio between 85/15 and 55/45 using the same temperature. The increase in the MDI adhesive ratio improves the MOE and MOR values. However, the internal bond was the contrary. This study suggests that a combination of UF/MDI at a ratio of 85/15 and hot-pressing temperature at 140 degrees C could produce a PB panel that meets a type 8 particleboard according to the JIS A5908-2003 standard and type P2 according to the EN 312-2010 standard.