Investigations into wetting and spreading behaviors of impacting metal droplet under ultrasonic vibration control

Ultrasonic-assisted metal droplet deposition (UAMDD) is currently considered a promising technology in dropletbased 3D printing due to its capability to change the wetting and spreading behaviors at the droplet-substrate interface. However, the involved contact dynamics during impacting droplet deposition, particularly the complex physical interaction and metallurgical reaction of induced wetting-spreading-solidification by the external energy, remain unclear to date, which hinders the quantitative prediction and regulation of the microstructures and bonding property of the UAMDD bumps. Here, the wettability of the impacting metal droplet ejected by a piezoelectric micro-jet device (PMJD) on non-wetting and wetting ultrasonic vibration substrates is studied, and the corresponding spreading diameter, contact angle, and bonding strength are also discussed. For the nonwetting substrate, the wettability of the droplet can be significantly increased due to the extrusion of the vibration substrate and the momentum transfer layer at the droplet-substrate interface. And the wettability of the droplet on a wetting substrate is increased at a lower vibration amplitude, which is driven by the momentum transfer layer and the capillary waves at the liquid-vapor interface. Moreover, the effects of the ultrasonic amplitude on the droplet spreading are studied under the resonant frequency of 18.2-18.4 kHz. Compared to deposit droplets on a static substrate, such UAMDD has 31% and 2.1% increments in the spreading diameters for the non-wetting and wetting systems, and the corresponding adhesion tangential forces are increased by 3.85 and 5.59 times.