Advances in multilayer graphene processes for metallization and high-frequency devices

被引:1
|
作者
Ueno, Kazuyoshi [1 ,2 ]
机构
[1] Shibaura Inst Technol, Dept Elect Engn, Tokyo 1358548, Japan
[2] Shibaura Inst Technol, Int Res Ctr Green Elect, Tokyo 1358548, Japan
关键词
multilayer graphene; interconnect; metallization; deposition; intercalation; high-frequency device; doping; CONDUCTIVITY; STABILITY;
D O I
10.35848/1347-4065/ac8884
中图分类号
O59 [应用物理学];
学科分类号
摘要
Multilayer graphene (MLG) has been proposed as an alternative material for nanometer-wide interconnects. However, it has not been put to practical use, since the process technology that leads to practical use has been immature. Recent advances in MLG processes and applications, such as MLG-capped copper interconnects, the direct deposition of MLG by solid-phase deposition (SPD) at a low temperature, stable intercalation doping to MLG and selective chemical vapor deposition (CVD) of high-crystallinity MLG for inductor and antenna applications are reviewed. Based on these advances, MLG is considered to be approaching the stage of practical application for device metallization and high-frequency devices. Based on the characteristics of MLG as a conductor and recent development trends, the prospects and issues regarding the future practical use of MLG graphene are discussed.
引用
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页数:10
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