Interfaces, modularity and ecosystem emergence: How DARPA modularized the semiconductor ecosystem

被引:9
作者
Kuan, Jennifer [1 ]
West, Joel [2 ,3 ]
机构
[1] Calif State Univ Monterey Bay, Coll Business, Seaside, CA 93955 USA
[2] Hildegard Coll, Costa Mesa, CA USA
[3] Keck Grad Inst, Claremont, CA USA
基金
美国国家科学基金会;
关键词
Modularity; R & amp; D policy; Open standards; Innovation ecosystems; Vertical disintegration; Fabless semiconductors; RESEARCH-AND-DEVELOPMENT; PRODUCT ARCHITECTURE; SUN MICROSYSTEMS; INNOVATION; TECHNOLOGY; INDUSTRY; ORGANIZATION; GOVERNMENT; HISTORY; FIRM;
D O I
10.1016/j.respol.2023.104789
中图分类号
C93 [管理学];
学科分类号
12 ; 1201 ; 1202 ; 120202 ;
摘要
Scholars have identified the pivotal role that modularity plays in promoting innovation. Modularity affects industry structure by breaking up the value chain along technical interfaces, thereby allowing new entrants to specialize and innovate. Less well-understood is where modularity comes from. Firms seem to behave consistently with the theory in some settings, especially the information technology sector, but not in others, such as automobiles. Here we show how the government has a role to play in generating open interfaces needed for modularity, utilizing a case study of the semiconductor industry from 1970 to 1980. We show how the Defense Department's support for this effort aligned with its mission-based interest in semiconductors. We thus contribute a new source of open standards to the modularity literature, as well as a new analytical perspective to the public research funding literature.
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页数:14
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