Simultaneously obtaining excellent formability and post-form strength in the traditional sheet metal forming of heat-treatable aluminum alloy is challenging, owing to the coexistence of wrinkling and splitting defects during forming and the control problem of microstructure. To solve these problems, W-temper cryogenic forming was proposed based on the cryogenic 'dual-enhancement effect' of an as-quenched (W-temper) aluminum alloy. The effects of the cryogenic temperature gradient and blank-holder force on the drawing behaviors were studied by analyzing the forming defects and thickness distribution. Strength distributions were reflected through Vickers hardness measurements under different aging conditions. The related strengthening mechanism was revealed through microstructure characterization. The drawability can be significantly improved at small or large cryogenic temperature gradients. An Al-Cu alloy semispherical shell component was fabricated via W-temper cryogenic forming. The depth of the formed hemispherical specimens increased by more than 106.4%. Uniform thickness can be also obtained at the temperature gradient of 216 degrees C, with an average thickness deviation rate of 6.5%, benefiting from the cryogenic dual enhancement effect and enlargement of the stress gradient. The hardness in all regions was higher than 146.5 HV of traditional T8-temper because of the enough accelerating precipitation of theta" and theta MODIFIER LETTER PRIME phases by prior cryogenic deformation. Strain and precipitation strengthening were the main strengthening mechanisms under post-forming and post-aging conditions, respectively. The peak-aging time can be shortened to 6 h, which is one-third that of the traditional process. Enhanced formability and post-form strength can be simultaneously obtained by W-temper cryogenic forming, which has great potential for the fabrication of thin shells made from heat-treatable aluminum alloys.
机构:
Hong Kong Polytech Univ, Dept Mfg Engn, Kowloon, Hong Kong, Peoples R ChinaHong Kong Polytech Univ, Dept Mfg Engn, Kowloon, Hong Kong, Peoples R China
Chan, KC
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Chow, KK
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Hong Kong Polytech Univ, Dept Mfg Engn, Kowloon, Hong Kong, Peoples R ChinaHong Kong Polytech Univ, Dept Mfg Engn, Kowloon, Hong Kong, Peoples R China
机构:
Univ Paris Saclay, CEA, DEN Serv Rech Met Appl, F-91191 Gif Sur Yvette, FranceUniv Paris Saclay, CEA, DEN Serv Rech Met Appl, F-91191 Gif Sur Yvette, France
Chbihi, A.
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Vincent, S.
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Univ Paris Saclay, CEA, DEN Serv Rech Met Appl, F-91191 Gif Sur Yvette, FranceUniv Paris Saclay, CEA, DEN Serv Rech Met Appl, F-91191 Gif Sur Yvette, France
Vincent, S.
;
Ribis, J.
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Univ Paris Saclay, CEA, DEN Serv Rech Met Appl, F-91191 Gif Sur Yvette, FranceUniv Paris Saclay, CEA, DEN Serv Rech Met Appl, F-91191 Gif Sur Yvette, France
Ribis, J.
;
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机构:
Toffolon-Masclet, C.
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Garnier, J.
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Univ Paris Saclay, CEA, DEN Serv Rech Met Appl, F-91191 Gif Sur Yvette, FranceUniv Paris Saclay, CEA, DEN Serv Rech Met Appl, F-91191 Gif Sur Yvette, France
机构:
Hong Kong Polytech Univ, Dept Mfg Engn, Kowloon, Hong Kong, Peoples R ChinaHong Kong Polytech Univ, Dept Mfg Engn, Kowloon, Hong Kong, Peoples R China
Chan, KC
;
Chow, KK
论文数: 0引用数: 0
h-index: 0
机构:
Hong Kong Polytech Univ, Dept Mfg Engn, Kowloon, Hong Kong, Peoples R ChinaHong Kong Polytech Univ, Dept Mfg Engn, Kowloon, Hong Kong, Peoples R China
机构:
Univ Paris Saclay, CEA, DEN Serv Rech Met Appl, F-91191 Gif Sur Yvette, FranceUniv Paris Saclay, CEA, DEN Serv Rech Met Appl, F-91191 Gif Sur Yvette, France
Chbihi, A.
;
Vincent, S.
论文数: 0引用数: 0
h-index: 0
机构:
Univ Paris Saclay, CEA, DEN Serv Rech Met Appl, F-91191 Gif Sur Yvette, FranceUniv Paris Saclay, CEA, DEN Serv Rech Met Appl, F-91191 Gif Sur Yvette, France
Vincent, S.
;
Ribis, J.
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h-index: 0
机构:
Univ Paris Saclay, CEA, DEN Serv Rech Met Appl, F-91191 Gif Sur Yvette, FranceUniv Paris Saclay, CEA, DEN Serv Rech Met Appl, F-91191 Gif Sur Yvette, France
Ribis, J.
;
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h-index:
机构:
Toffolon-Masclet, C.
;
Garnier, J.
论文数: 0引用数: 0
h-index: 0
机构:
Univ Paris Saclay, CEA, DEN Serv Rech Met Appl, F-91191 Gif Sur Yvette, FranceUniv Paris Saclay, CEA, DEN Serv Rech Met Appl, F-91191 Gif Sur Yvette, France