Effect of in-situ SiNx grown with different carrier gas on structural and electrical properties of GaN-based MISHEMTs

被引:15
作者
Zhang, Haochen [1 ,2 ]
Chen, Yao [2 ]
Sun, Yue [1 ]
Yang, Lei [1 ]
Hu, Kunpeng [1 ]
Huang, Zhe [1 ]
Liang, Kun [1 ]
Xing, Zhanyong [1 ]
Wang, Hu [1 ]
Zhang, Mingshuo [1 ]
Guo, Shiping [2 ]
Sun, Haiding [1 ]
机构
[1] Univ Sci & Technol China, Sch Microelect, Hefei 230026, Anhui, Peoples R China
[2] Adv Microfabricat Equipment Inc, 88 Taihua Rd, Shanghai 201201, Peoples R China
基金
中国国家自然科学基金;
关键词
THRESHOLD VOLTAGE INSTABILITY; SILICON-NITRIDE; MOBILITY TRANSISTORS; ALGAN/GAN HEMTS; PASSIVATION; DEPOSITION;
D O I
10.1063/5.0146447
中图分类号
O59 [应用物理学];
学科分类号
摘要
In this work, the effect of in situ SiNx grown with different carrier gas on the structural and electrical properties of the SiNx/AlGaN/GaN MIS-HEMTs is studied. It was found that the growth rate of SiNx grown with N-2 as carrier gas (N-2-SiNx) is more sensitive to different growth conditions, while the growth rate of SiNx grown with H-2 as carrier gas (H-2-SiNx) is very stable due to the inhibiting effects of H-2 carrier gas on the SiH4-NH3 forward reactions. More importantly, a continuous and smooth SiNx growth at the initial stage can be realized with H-2 carrier gas due to its faster surface migration, leading to a decent surface morphology and sharp interface of H-2-SiNx. As a result, the SiNx passivated device with H-2 as carrier gas shows improved performance compared to that with N-2 as carrier gas, featuring ultra-low interface-state density of 2.8 x 10(10) cm(-2 )eV(-1), improved on- and off-state current, reduced threshold voltage shift, and mitigated current collapse, especially after long-term electrical stress. These results not only elaborate on the growth mechanisms of in situ SiNx with different carrier gases but also highlight the advances of H-2 as carrier gas for in situ SiNx growth, providing an effective strategy to tailor the passivation schemes for GaN-based devices.
引用
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页数:6
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