Routing-aware Legal Hybrid Bonding Terminal Assignment for 3D Face-to-Face Stacked ICs

被引：0

作者：

Liu, Siting ^{[1
]}

Jiang, Jiaxi ^{[1
]}

He, Zhuolun ^{[1
]}

Wang, Ziyi ^{[1
]}

Lin, Yibo ^{[2
,3
]}

Yu, Bei ^{[1
]}

机构：

[1] Chinese Univ Hong Kong, Hong Kong, Peoples R China

[2] Peking Univ, Beijing, Peoples R China

[3] Peking Univ, Inst EDA, Beijing, Peoples R China

来源：

PROCEEDINGS OF THE 2024 INTERNATIONAL SYMPOSIUM ON PHYSICAL DESIGN, ISPD 2024 | 2024年

关键词：

3D ICs; Bonding Terminal Planning; Routing; Generalized Assignment Problem; Divide and Conquer; DESIGN;

D O I：

10.1145/3626184.3633322

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

Face-to-face (F2F) stacked 3D IC is a promising alternative for scaling beyond Moore's Law. In F2F 3D ICs, dies are connected through bonding terminals whose positions can significantly impact routing performance. Further, there exists resource competition among all the 3D nets due to the constrained bonding terminal number. In advanced technology nodes, such 3D integration may also introduce legality challenges of bonding terminals, as the metal pitches can be much smaller than the sizes of bonding terminals. Previous works attempt to insert bonding terminals automatically using existing 2D commercial P&R tools and then consider inter-die connection legality, but they fail to take the legality and routing performance into account simultaneously. In this paper, we explore the formulation of the generalized assignment in the hybrid bonding terminal assignment problem. Our framework, BTAssign, offers a strict legality guarantee and an iterative solution. The experiments are conducted on 18 open-source designs with various 3D net densities and the most advanced bonding scale. The results reveal that BTAssign can achieve improvements in routed wirelength under all testing conditions from 1.0% to 5.0% with a tolerable runtime overhead.

引用

页码：75 / 82

页数：8