Effect of Sn content on the passivity of Ti-Ta-Sn alloys

被引:7
作者
Valverde, B. [1 ]
Sancy, M. [2 ]
Martinez, C. [3 ]
Botello, E. [4 ]
Pio, E. [5 ]
Aguilar, C. [5 ]
机构
[1] Pontificia Univ Catolica Valparaiso, Fac Ciencias, Inst Quim, Valparaiso, Chile
[2] Pontificia Univ Catolica Chile, Fac Ingn, Escuela Construct Civil, Santiago, Chile
[3] Univ La Frontera, Dept Ingn Obras Civiles, Temuco, Chile
[4] Pontificia Univ Catolica Chile, Escuela Med, Santiago, Chile
[5] Univ Tecn Federico Santa Maria, Dept Ingn Met & Mat, Valparaiso, Chile
基金
芬兰科学院;
关键词
Ti-Ta-Sn alloys; Sn content; Microstructure properties; Electrochemical behavior; Biomedical implants; Porous electrode; MECHANICAL-PROPERTIES; CORROSION BEHAVIOR; MICROSTRUCTURE; REFINEMENT; TI-6AL-7NB; MODEL; NB;
D O I
10.1016/j.corsci.2022.110887
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this work, Ti-13Ta-xSn samples were manufactured using the powder metallurgy technique with a porosity near 35 %. The microstructural analysis revealed that increased Sn content decreased the alpha-Ti and alpha'-Ti phases. Furthermore, scanning electron microscopy and X-ray photoelectron spectroscopy showed that the chemical composition of the passive oxide film was influenced by the Sn content. Moreover, the electrochemical analysis revealed that the protective properties of oxide film improved with the Sn addition.
引用
收藏
页数:9
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