Coexistence of Space Charge Limited and Variable Range Hopping Conduction Mechanism in Sputter-Deposited Au/SiC Metal-Semiconductor-Metal Device

被引:8
作者
Arora, Alisha [1 ]
Mourya, Satyendra [2 ]
Singh, Neetika [3 ]
Kumar, Sandeep [4 ]
Chandra, Ramesh [1 ]
Malik, V. K. [1 ]
机构
[1] Indian Inst Technol Roorkee, Roorkee 247667, India
[2] Birla Inst Technol & Sci Pilani, Pilani 333031, India
[3] Ben Gurion Univ Negev, Dept Chem Engn, IL-8410501 Beer Sheva, Israel
[4] Cent Univ Rajasthan, Dept Phys, Ajmer 305817, India
关键词
Metal-semiconductor-metal (MSM) junction; RF sputtering; silicon carbide (SiC) thin films; SILICON-CARBIDE; GROWTH; FILMS; TRANSPORT; SI;
D O I
10.1109/TED.2022.3232472
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
being the cornerstone of high-temperature and high-power applications, the fabrication of silicon carbide (SiC) thin films has been a major chal-lenge among research activities related to wide bandgap semiconductors. As almost all the reported SiC thin films produced by RF sputtering are amorphous, the growth of crystalline thin film on p-type silicon substrate at high temperature (> 900 degrees C) is presented in this work. A metal-semiconductor-metal (MSM) device is fabricated with gold (Au) electrodes by sputtering. A unique behavior of current-voltage (I-V) characteristics is found in different voltage regimes. The thermionic emission model fails to explain the observed I-V characteristics. To understand the current transport mechanism in detail, I-V characteristics are carried out in the temperature range 250-380 K and divided into two voltage regimes, below and above 1 V. Below 1 V, variable range hopping mechanism (VRH) is found to be dominant and above 1 V, and ohmic conduction followed by space charge limited conduction (SCLC) is held accountable for the current transport mechanism. The analysis of both mechanisms indicates the presence of disorder states and gives valuable information about trap centers. The C-V characteristics further suggest the pres-ence of interface states and deep traps. The advantageous implementation of this information will help to design opto-electronic, magnetic, and efficient energy storage devices to extract the maximum performance.
引用
收藏
页码:714 / 719
页数:6
相关论文
共 44 条
  • [1] Ahyi A. C., 2019, PROC IEEE INT REL PH, P2, DOI [10.1109/IRPS.2019.8720571, DOI 10.1109/IRPS.2019.8720571]
  • [2] THERMAL-OXIDATION OF GH-SILICON CARBIDE AT ENHANCED GROWTH-RATES
    ALOK, D
    BALIGA, BJ
    MCLARTY, PK
    [J]. IEEE ELECTRON DEVICE LETTERS, 1994, 15 (10) : 424 - 426
  • [3] Evaluation of Schottky contact parameters in metal-semiconductor-metal photodiode structures
    Averine, S
    Chan, YC
    Lam, YL
    [J]. APPLIED PHYSICS LETTERS, 2000, 77 (02) : 274 - 276
  • [4] State of the art of high temperature power electronics
    Buttay, Cyril
    Planson, Dominique
    Allard, Bruno
    Bergogne, Dominique
    Bevilacqua, Pascal
    Joubert, Charles
    Lazar, Mihai
    Martin, Christian
    Morel, Herve
    Tournier, Dominique
    Raynaud, Christophe
    [J]. MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS, 2011, 176 (04): : 283 - 288
  • [5] Electrical characterization of GaN Schottky barrier diode at cryogenic temperatures
    Chen, Jiaxiang
    Zhu, Min
    Lu, Xing
    Zou, Xinbo
    [J]. APPLIED PHYSICS LETTERS, 2020, 116 (06)
  • [6] Electronic Conduction Mechanisms in Insulators
    Chiang, Tsung-Han
    Wager, John F.
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 2018, 65 (01) : 223 - 230
  • [8] Smart Power Devices and ICs Using GaAs and Wide and Extreme Bandgap Semiconductors
    Chow, T. Paul
    Omura, Ichiro
    Higashiwaki, Masataka
    Kawarada, Hiroshi
    Pala, Vipindas
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 2017, 64 (03) : 856 - 873
  • [9] Low-concentration deep traps in 4H-SiC grown with high growth rate by chemical vapor deposition
    Danno, K
    Hashimoto, K
    Saitoh, H
    Kimoto, T
    Matsunami, H
    [J]. JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS, 2004, 43 (7B): : L969 - L971
  • [10] Davis R., 2017, Reference Module in Materials Science and Materials Engineering, DOI [DOI 10.1016/B978-0-12-803581-8.02445-0, 10.1016/b978-0-12-803581-8.02445-0]