Direct Fabrication of a Copper RTD over a Ceramic-Coated Stainless-Steel Tube by Combination of Magnetron Sputtering and Sol-Gel Techniques

被引:1
作者
Bikarregi, Aitor [1 ,2 ]
Dominguez, Santiago [3 ]
Brizuela, Marta [3 ]
Lopez, Alejandra [1 ]
Suarez-Vega, Ana [3 ]
Agustin-Saenz, Cecilia [3 ]
Presa, Micael [4 ]
Lopez, Gabriel A. [2 ]
机构
[1] Tubacex Innovac SL, Derio 48160, Spain
[2] Univ Basque Country, Fac Sci & Technol, Phys Dept, Barrio Sarriena S-N, Leioa 48940, Spain
[3] Tecnalia Res & Innovat, San Sebastian 20009, Spain
[4] Tubacoat SL, Derio 48160, Spain
关键词
thin film; RTD; copper sensor; magnetron sputtering; sol-gel; tube; RESISTANCE TEMPERATURE DETECTOR; WIRELESS SENSOR NETWORKS; DIFFUSION BARRIER; THIN-FILM; ELECTRICAL INSULATION; SILICON; PERFORMANCE; TANTALUM; LAYER; SIO2;
D O I
10.3390/s23125442
中图分类号
O65 [分析化学];
学科分类号
070302 ; 081704 ;
摘要
Reducing the economic and environmental impact of industrial process may be achieved by the smartisation of different components. In this work, tube smartisation is presented via direct fabrication of a copper (Cu)-based resistive temperature detector (RTD) on their outer surfaces. The testing was carried out between room temperature and 250 & DEG;C. For this purpose, copper depositions were studied using mid-frequency (MF) and high-power impulse magnetron sputtering (HiPIMS). Stainless steel tubes with an outside inert ceramic coating were used after giving them a shot blasting treatment. The Cu deposition was performed at around 425 & DEG;C to improve adhesion as well as the electrical properties of the sensor. To generate the pattern of the Cu RTD, a photolithography process was carried out. The RTD was then protected from external degradation by a silicon oxide film deposited over it by means of two different techniques: sol-gel dipping technique and reactive magnetron sputtering. For the electrical characterisation of the sensor, an ad hoc test bench was used, based on the internal heating and the external temperature measurement with a thermographic camera. The results confirm the linearity (R-2 > 0.999) and repeatability in the electrical properties of the copper RTD (confidence interval < 0.0005).
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页数:18
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  • [1] Wireless Sensor Networks in oil and gas industry: Recent advances, taxonomy, requirements, and open challenges
    Aalsalem, Mohammed Y.
    Khan, Wazir Zada
    Gharibi, Wajeb
    Khan, Muhammad Khurram
    Arshad, Quratulain
    [J]. JOURNAL OF NETWORK AND COMPUTER APPLICATIONS, 2018, 113 : 87 - 97
  • [2] Characteristics of an Amorphous Carbon Layer as a Diffusion Barrier for an Advanced Copper Interconnect
    An, Byeong-Seon
    Kwon, Yena
    Oh, Jin-Su
    Lee, Changmin
    Choi, Seongheum
    Kim, Hyoungsub
    Lee, Miji
    Pae, Sangwoo
    Yang, Cheol-Woong
    [J]. ACS APPLIED MATERIALS & INTERFACES, 2020, 12 (02) : 3104 - 3113
  • [3] Properties of SiO2 and Al2O3 films for electrical insulation applications deposited by reactive pulse magnetron sputtering
    Bartzsch, H
    Glöss, D
    Böcher, B
    Frach, P
    Goedicke, K
    [J]. SURFACE & COATINGS TECHNOLOGY, 2003, 174 : 774 - 778
  • [4] Towards next generation virtual power plant: Technology review and frameworks
    Bhuiyan, Erphan A.
    Hossain, Md. Zahid
    Muyeen, S. M.
    Fahim, Shahriar Rahman
    Sarker, Subrata K.
    Das, Sajal K.
    [J]. RENEWABLE & SUSTAINABLE ENERGY REVIEWS, 2021, 150
  • [5] Physical, chemical and electrical characterisation of the diffusion of copper in silicon dioxide and prevention via a CuAl alloy barrier layer system
    Byrne, C.
    Brennan, B.
    Lundy, R.
    Bogan, J.
    Brady, A.
    Gomeniuk, Y. Y.
    Monaghan, S.
    Hurley, P. K.
    Hughes, G.
    [J]. MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2017, 63 : 227 - 236
  • [7] Barrier properties of ultrathin amorphous Al-Ni alloy film in Cu/Si or Cu/SiO2 contact system
    Chen, J. H.
    Huo, J. C.
    Dai, X. H.
    Wei, L. J.
    Guo, J. X.
    Li, X. H.
    Wang, L. H.
    Lu, C. J.
    Wang, J. B.
    Liu, B. T.
    [J]. PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE, 2017, 214 (02):
  • [8] Effectiveness of tungsten addition on the performance of electroplated nickel diffusion barriers for copper metallization on textured silicon
    Chen, Wen Jauh
    Lai, Ting-Yu
    [J]. THIN SOLID FILMS, 2022, 746
  • [9] Fast responding and highly reversible gasochromic H2 sensor using Pd-decorated amorphous WO3 thin films
    Cho, Sung Hwan
    Suh, Jun Min
    Jeong, Beomgyun
    Lee, Tae Hyung
    Choi, Kyoung Soon
    Eom, Tae Hoon
    Kim, Taehoon
    Jang, Ho Won
    [J]. CHEMICAL ENGINEERING JOURNAL, 2022, 446
  • [10] Fabrication and characterization of nickel thin film as resistance temperature detector
    Cui, Jinting
    Liu, Hao
    Li, Xingliang
    Jiang, Shuwen
    Zhang, Bin
    Song, Ying
    Zhang, Wanli
    [J]. VACUUM, 2020, 176 (176)