Substrate-Integrated Waveguide Filtering Crossover Based on 3-D Assembly

被引：11

作者：

Yao, Beini ^{[1
]}

Zhang, Gang ^{[1
,2
]}

Zhou, Xin ^{[1
]}

Li, Na ^{[1
]}

Tang, Wanchun ^{[1
]}

Yang, Jiquan ^{[1
]}

机构：

[1] Nanjing Normal Univ, Sch Elect & Automation Engn, Jiangsu Key Lab Printing Equipment & Mfg 3D, Nanjing 210046, Peoples R China

[2] Hengdian Elect Co Ltd, Nanjing 210049, Peoples R China

来源：

IEEE MICROWAVE AND WIRELESS TECHNOLOGY LETTERS | 2023年 / 33卷 / 05期

基金：

中国国家自然科学基金;

关键词：

Filtering; Couplings; Substrates; Wireless communication; Microwave filters; Proposals; Band-pass filters; 3-D assembly; filtering crossover; orthogonality; substrate-integrated waveguide (SIW); COMPACT; DESIGN;

D O I：

10.1109/LMWT.2023.3235414

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A novel substrate-integrated waveguide (SIW) fil -tering crossover based on 3-D assembly is proposed, for the first time. The degenerate orthogonality of the TE102 mode and TE201 mode is fully utilized to obtain good cross-transmission and interchannel isolation. In addition, four resonant printed circuit boards (PCBs) are spliced and assembled like building blocks, successfully achieving energy transmission at different heights. The combined application of E-plane and H-plane is realized in filtering crossover design, for the first time. A K-band prototype is designed, fabricated, and measured to validate the proposal. Good consistency is demonstrated between the simulated results and the measured ones.

引用

页码：523 / 526

页数：4

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