Characterization of a Flexible Polymer-Based Substrate Material for RF Applications

被引：0

作者：

Michler, Fabian ^{[1
]}

Kolpak, Jasmin ^{[1
]}

Scheiner, Benedict ^{[1
]}

Weigel, Robert ^{[1
]}

Hagelauer, Amelie ^{[2
,3
]}

机构：

[1] Friedrich Alexander Univ Erlangen Nurnberg, Inst Elect Engn, Erlangen, Germany

[2] Tech Univ Munich, Chair Micro & Nanosyst Technol, Munich, Germany

[3] Fraunhofer EMFT Res Inst Microsyst & Solid State, Munich, Germany

来源：

2023 IEEE RADIO AND WIRELESS SYMPOSIUM, RWS | 2023年

关键词：

material characterization; flexible electronics; microwave measurements; permittivity; printed circuit boards;

D O I：

10.1109/RWS55624.2023.10046309

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

While mechanically flexible substrate materials are widely used in electronics, especially for interconnects between moving system parts or medical sensors to be mounted onto the body surface, they are barely used in micro- and millimeter-wave applications. In this work, the design permittivity of a low-cost, polymer-based flexible substrate is extracted by measurement and the insertion losses of typical line structures are measured. Moreover, application examples of a patch antenna and a bendable substrate-integrated waveguide are presented.

引用

页码：27 / 30

页数：4

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