Composite Wafer Defect Recognition Framework Based on Multiview Dynamic Feature Enhancement With Class-Specific Classifier

被引:11
作者
Luo, Wenjun [1 ]
Wang, Huan [2 ]
机构
[1] Univ Elect Sci & Technol China, Glasgow Coll, Chengdu 611731, Peoples R China
[2] Tsinghua Univ, Dept Ind Engn, Beijing 100084, Peoples R China
关键词
Feature extraction; Pattern recognition; Convolutional neural networks; Semiconductor device modeling; Manufacturing processes; Fabrication; Task analysis; Attention mechanism; convolutional neural network (CNN); defect pattern recognition; wafer map; NEURAL-NETWORK; PATTERNS;
D O I
10.1109/TIM.2023.3261924
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Wafer defect pattern recognition is important for the manufacturing of semiconductor products. By recognizing the type of defect, the engineer can optimize the process of semiconductor manufacturing. Due to the complexity of the manufacturing process, composite defect types can occur on a single wafer map. As a result, there are even more than 30 defect types in real life, which greatly increases the difficulty of recognizing. To address this problem, we propose a composite wafer defect recognition framework (CWDR-Net) based on a multiview dynamic feature enhancement (MVDFE) module with a class-specific classifier. This framework can selectively extract information from the defect pattern and class-specifically recognize each basic defect type. Specifically, the proposed MVDFE-module can view the feature from three different perspectives and dynamically enhance it accordingly. In addition, the proposed framework applies a class-specific classifier that uses an attention mechanism to recalibrate the feature for each type of basic defect. A real dataset with eight basic single-type defects and 29 mixed-type composite defects is used to evaluate this framework. The results show that the proposed framework can effectively recognize composite defects and outperform the other state-of-the-art methods.
引用
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页数:12
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