Direct-ink-writing 3D-printed bioelectronics

被引:41
作者
Tay, Roland Yingjie [1 ,2 ]
Song, Yu [1 ]
Yao, Dickson R. [1 ]
Gao, Wei [1 ]
机构
[1] CALTECH, Andrew & Peggy Cherng Dept Med Engn, Pasadena, CA 91125 USA
[2] Nanyang Technol Univ, Sch Elect & Elect Engn, 50 Nanyang Ave, Singapore 639798, Singapore
基金
美国国家卫生研究院; 美国国家科学基金会;
关键词
SOFT MATTER; ELECTRONIC SKIN; SENSORS; DEVICES; TRANSPARENT; FABRICATION; CHALLENGES; MANAGEMENT; HYDROGEL; GRAPHENE;
D O I
10.1016/j.mattod.2023.09.006
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The development of wearable and implantable bioelectronics has garnered significant momentum in recent years, driven by the ever-increasing demand for personalized health monitoring, remote patient management, and real-time physiological data collection. The elevated sophistication and advancement of these devices have thus led to the use of many new and unconventional materials which cannot be fulfilled through traditional manufacturing techniques. Three-dimension (3D) printing, also known as additive manufacturing, is an emerging technology that opens new opportunities to fabricate next-generation bioelectronic devices. Some significant advantages include its capacity for material versatility and design freedom, rapid prototyping, and manufacturing efficiency with enhanced capabilities. This review provides an overview of the recent advances in 3D printing of bioelectronics, particularly direct ink writing (DIW), encompassing the methodologies, materials, and applications that have emerged in this rapidly evolving field. This review showcases the broad range of bioelectronic devices fabricated through 3D printing including wearable biophysical sensors, devices, and soft robots. This review will also discuss the advantages, existing challenges, and outlook of applying DIW 3D printing for the development of bioelectronic devices toward healthcare applications.
引用
收藏
页码:135 / 151
页数:17
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