共 73 条
[31]
Lie J, Automotive Industry Supports Additive Manufacturing
[32]
Comprehensive Review and State of Development of Double-Sided Cooled Package Technology for Automotive Power Modules
[J].
IEEE OPEN JOURNAL OF POWER ELECTRONICS,
2022, 3
:271-289
[33]
FPGA-Based Forced Air-Cooled SiC High-Power-Density Inverter for Electrical Aircraft Applications
[J].
2023 IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION, APEC,
2023,
:3169-3173
[34]
Lopera Luis, 2021, IEEE Open Journal of Power Electronics, V2, P33, DOI [10.1109/ojpel.2021.3052541, 10.1109/OJPEL.2021.3052541]
[38]
Maroti K. P., 2022, Power Electron. Devices Compon., V1
[39]
Miozga Rafael, 2021, MATEC Web of Conferences, V338, DOI [10.1051/matecconf/202133801017, 10.1051/matecconf/202133801017]
[40]
Moeller S., 2020, PROC 11 INT C INTEGR, P1