Laser powder bed fusion of a Cu-Ni-Al alloy using the compositional grading approach

被引:13
作者
Wei, Siyuan [1 ]
Zhao, Yakai [1 ]
Li, Shi-Hao [1 ]
Chen, Shilin [2 ]
Lau, Kwang Boon [2 ]
Soh, Verner [2 ]
Lee, Jing Jun [2 ]
Zhang, Baicheng [3 ]
Tan, Cheng Cheh [2 ]
Wang, Pei [2 ,4 ]
Ramamurty, Upadrasta [1 ,2 ]
机构
[1] Nanyang Technol Univ, Sch Mech & Aerosp Engn, Singapore 639798, Singapore
[2] Agcy Sci Technol & Res, Inst Mat Res & Engn, Singapore 138634, Singapore
[3] Univ Sci & Technol Beijing, Adv Mat & Technol Inst, Beijing 100083, Peoples R China
[4] Singapore Inst Technol, Engn Cluster, Singapore 519961, Singapore
关键词
Laser powder bed fusion; Copper alloys; Compositional graded alloy; Mechanical properties; Electrical resistivity; conductivity; MICROSTRUCTURE EVOLUTION; STAINLESS-STEEL; COPPER; COMPONENTS;
D O I
10.1016/j.scriptamat.2023.115441
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Using a modified laser powder bed fusion (LPBF) technique, a compositionally graded Cu-Ni alloy was fabricated. Through microstructural and mechanical characterization on the samples extracted from it, the addition of 7.6 wt.% Ni to Cu is identified as the minimum required for obtaining a crack-free and nearly-fully-dense coupons using LPBF. Subsequently, 3 wt.% Al was added to the Cu-7.6 wt.% alloy to deplete the solute Ni atoms from the matrix through the precipitation of Ni3Al upon aging of the LPBF Cu-Ni-Al alloy, which simultaneously enhances the strength and electrical conductance of the alloy. Through this example, we demonstrate the potential of high-throughput screening of alloys suitable for LPBF through the fabrication of the compositionally graded alloys and subsequent alloy design for optimum property combinations.
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页数:7
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