Effect of pad surface morphology on the surface shape of the lapped workpiece

被引:1
作者
Yang, Lei [1 ]
Guo, Xiaoguang [1 ]
Kang, Renke [1 ]
Zhu, Xianglong [1 ]
Jia, Yufan [1 ]
Wang, Hao [1 ]
机构
[1] Dalian Univ Technol, State Key Lab High performance Precis Mfg, Dalian 116024, Peoples R China
来源
PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY | 2024年 / 85卷
基金
中国国家自然科学基金;
关键词
Double-sided lapping; Analytical model; Pad surface morphology; Surface shape; Real-time dynamical contact; Influence mechanism; FINITE-ELEMENT-ANALYSIS; EDGE ROLL-OFF; MATERIAL REMOVAL; MECHANICAL WEAR; MODEL; SILICON; PARTICLE; OPTIMIZATION; DEFORMATION; SIMULATION;
D O I
10.1016/j.precisioneng.2023.10.008
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Double-sided lapping is currently the mainstream manufacturing method for obtaining plane-parallel optical workpieces with high surface shape accuracy, and the fixed abrasive lapping pad is the main machining tool. However, the effect of pad surface morphology on the workpiece surface shape has rarely been studied, and its formation mechanism has not yet been revealed. In this paper, based on probabilistic statistics and contact mechanics, an analytical model that takes into account the pad surface morphology for predicting the workpiece surface shape evolution is developed. Notably, this model considers the cross-scale relationship between the formation of lapped surface shape and the scratching process of a single abrasive grain in material removal for the first time. Furthermore, the real-time dynamical contact relationship between the workpieces and the measured actual pad surface morphology is also considered. The surface shape and peak-to-valley value of the workpiece under different parameters were simulated and analyzed, and the influence mechanism of the local profile and macro shape of the lapping pad on the lapped workpiece surface shape are clarified. Moreover, the double-sided lapping trial experiments were performed to validate the theoretical model, and the experimental results demonstrated good agreement with the simulation results. The maximum error of the surface shape evolution prediction model is less than 14.6 %. This result verifies the correctness and validity of the established model. This work not only provides new ideas for controlling the workpiece surface but also forms the theoretical basis for understanding the double-sided lapping process.
引用
收藏
页码:247 / 262
页数:16
相关论文
共 61 条
  • [1] A model for mechanical wear and abrasive particle adhesion during the chemical mechanical polishing process
    Ahmadi, G
    Xia, X
    [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2001, 148 (03) : G99 - G109
  • [2] Ductile-regime grinding. A new technology for machining brittle materials
    Bifano, T.G.
    Dow, T.A.
    Scattergood, R.O.
    [J]. Journal of engineering for industry, 1991, 113 (02): : 184 - 189
  • [3] High-Power Solid-State Lasers: a Laser Glass Perspective
    Campbell, John H.
    Hayden, Joseph S.
    Marker, Alex
    [J]. INTERNATIONAL JOURNAL OF APPLIED GLASS SCIENCE, 2011, 2 (01) : 3 - 29
  • [4] Multi-scale modeling and simulation of material removal characteristics in computer-controlled bonnet polishing
    Cao, Zhong-Chen
    Cheung, Chi Fai
    [J]. INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES, 2016, 106 : 147 - 156
  • [5] HIGHLY ACCURATE FLATNESS AND PARALLELISM IN THE MANUFACTURE OF THIN SAPPHIRE FLAT LENSES
    CHANG, RS
    CHERN, DC
    [J]. OPTICAL ENGINEERING, 1994, 33 (02) : 620 - 626
  • [6] Finite-element analysis on wafer-level CMP contact stress: reinvestigated issues and the effects of selected process parameters
    Chen, K. -S.
    Yeh, H. -M.
    Yan, J. -L.
    Chen, Y. -T.
    [J]. INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2009, 42 (11-12) : 1118 - 1130
  • [7] Modeling the effects of particle deformation in chemical mechanical polishing
    Chen, Xiaochun
    Zhao, Yongwu
    Wang, Yongguang
    [J]. APPLIED SURFACE SCIENCE, 2012, 258 (22) : 8469 - 8474
  • [8] On the mechanism of material removal by fixed abrasive lapping of various glass substrates
    Cho, Young-Jun
    Kim, Hyuk-Min
    Manivannan, R.
    Moon, Deog-Ju
    Park, Jin-Goo
    [J]. WEAR, 2013, 302 (1-2) : 1334 - 1339
  • [9] Grinding performance of textured monolayer CBN wheels: Undeformed chip thickness nonuniformity modeling and ground surface topography prediction
    Ding, Wenfeng
    Dai, Chenwei
    Yu, Tianyu
    Xu, Jiuhua
    Fu, Yucan
    [J]. INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE, 2017, 122 : 66 - 80
  • [10] A plasticity-based model of material removal in chemical-mechanical polishing (CMP)
    Fu, GH
    Chandra, A
    Guha, S
    Subhash, G
    [J]. IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2001, 14 (04) : 406 - 417