Parameter fitting of constitutive model and FEM analysis of solder joint thermal cycle reliability for lead-free solder Sn-3.5Ag

被引：0
|
作者：
周萍 [1 ]
胡炳亭 [1 ]
周孑民 [1 ]
杨莺 [1 ]
机构：
[1] School of Energy Science and Engineering,Central South University
来源：
Journal of Central South University of Technology | 2009年 / 16卷 / 03期
基金：
中国国家自然科学基金;
关键词：
lead free solder; Sn-3.5Ag alloy; Sn-37Pb alloy; constitutive model; tensile; FEM analysis; thermal cycle reliability;
D O I：
暂无
中图分类号：
TN05 [制造工艺及设备];
学科分类号：
080901 ;
摘要：
The experimental tests of tensile for lead-free solder Sn-3.5Ag were performed for the general work temperatures range from 11 to 90 ℃ and strain rate range from 5×10-5 to 2×10-2 s-1, and its stress—strain curves were compared to those of solder Sn-37Pb. The parameters in Anand model for solder Sn-3.5Ag were fitted based on experimental data and nonlinear fitting method, and its validity was checked by means of experimental data. Furthermore, the Anand model was used in the FEM analysis to evaluate solder joint thermal cycle reliability. The results show that solder Sn-3.5Ag has a better creep resistance than solder Sn-37Pb. The maximum stress is located at the upper right corner of the outmost solder joint from the symmetric center, and thermal fatigue life is predicted to be 3.796×104 cycles under the calculated conditions.
引用
收藏
页码：339 / 343
页数：5
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