Process of electroless plating Cu-Sn-Zn ternary alloy

被引：0
|
作者：
何新快 [1 ]
陈白珍 [2 ]
胡更生 [1 ]
邓凌峰 [1 ]
周宁波 [2 ]
田文增 [2 ]
机构：
[1] School of Packaging and Printing, Zhuzhou Institute of Technology, Zhuzhou 412008, China
[2] School of Metallurgical Science and Engineering, Central South University, Changsha 410083, China
来源：
Transactions of Nonferrous Metals Society of China | 2006年 / 01期
关键词：
electroless plating; Cu-Sn-Zn ternary alloy; color-change resistance; corrosion resistance;
D O I：
暂无
中图分类号：
TG174.44 [金属复层保护];
学科分类号：
摘要：
Cu-Sn-Zn ternary alloy layer with 10 μm thickness was prepared through electroless plating method. The influences of process conditions including the concentration of metallic salts, reductant and complex agent on Cu-Sn-Zn alloy were studied in details. The stability to bear color changes and corrosion resistance of Cu-Sn-Zn film layer were studied through air-exposure experiment and electrochemical analyses test respectively. The results show that the performances of Cu-Sn-Zn film layer are obviously superior to brass matrix. By use of SEM,EDS and XRD, the morphology, microstructure and chemical composition were investigated. The results show that complex agent can increase the content of Sn and Zn, improve the evenness and compactness and decrease needle holes, therefore the properties of electroless plating layer such as the stability to bear color changes and corrosion resistance are improved remarkably. The probable mechanism of complex agent was discussed.
引用
收藏
页码：223 / 228
页数：6
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