Enhanced adhesion of Cu-W thin films by ion beam assisting bombardment implanting

被引：0

作者：

周灵平 ^{[1
]}

汪明朴 ^{[1
]}

王瑞 ^{[2
]}

李周 ^{[1
]}

朱家俊 ^{[2
]}

彭坤 ^{[2
]}

李德意 ^{[2
]}

李绍禄 ^{[2
]}

机构：

[1] School of Materials Science and Engineering,Central South University

[2] College of Materials Science and Engineering,Hunan University

来源：

Transactions of Nonferrous Metals Society of China | 2008年 / 02期

关键词：

Cu-W thin film; adhesive strength; ion beam; magnetron sputtering; interface;

D O I：

暂无

中图分类号：

TB383.2 [];

学科分类号：

070205 ; 080501 ; 1406 ;

摘要：

Cu-W thin film with high W content was deposited by dual-target DC-magnetron co-sputtering technology.Effects of the substrates surface treating technique on the adhesive strength of Cu-W thin films were studied.It is found that the technique of ion beam assisting bombardment implanting of W particles can remarkably improve the adhesive property of Cu-W thin films. Indentation and scratching test show that,the critical load is doubled over than the sample only sputter-cleaned by ion beam.The enhancing mechanism of ion beam assisting bombardment implanting of Cu-W thin films was analyzed.With the help of mid-energy Ar+ion beam,W atoms can diffuse into the Fe-substrate surface layer;Fe atoms in the substrate surface layer and W atoms interlace with one another;and microcosmic mechanical meshing and diffusing combination on atom-scale among the Fe and W atoms through the film/substrate interface can be formed.The wettability and thermal expansion properties of the W atoms diffusion zone containing plentiful W atoms are close to those of pure W or W-based Cu-W film.

引用

页码：372 / 377

页数：6

共 5 条

[1]

Characteristics of MOS diodes fabricated using sputter-deposited W or Cu/W films[J] . Spiros Tsevas,Maria Vasilopoulou,Dimitrios N. Kouvatsos,Thanassis Speliotis,Dimitris Niarchos.Microelectronic Engineering . 2006 (4)

[2]

Surface anisotropy characterization and microstructure of Cu–W thin films at different annealing temperatures[J] . Wang Yuan,Bai Xuanyu,Xu Kewei.Physica B: Physics of Condensed Matter . 2004 (1)

[3] Characterizations of super hard Cu films containing insoluble W prepared by sputter deposition [J].

Chu, JP ;

Liu, CJ ;

Lin, CH ;

Lin, TN ;

Wang, SF .

MATERIALS CHEMISTRY AND PHYSICS, 2001, 72 (02) :286-289

[4]

Adhesive metal films obtained by thermionic vacuum arc （TVA） deposition[J] . H Ehrich,J Schuhmann,G Musa,A Popescu,I Mustata.Thin Solid Films . 1998 (1)

[5]

Surface effects on the growth, adhesion and properties of reactively deposited hard coatings[J] . D.M. Mattox.Surface ＆ Coatings Technology . 1996 (1)

← 1 →