Spacing optimization of high power LED arrays for solid state lighting

被引：0

作者：

Y.Sing Chan ^{[1
]}

S.W.Ricky Lee ^{[1
]}

机构：

[1] Electronic Packaging Laboratory Center for Advanced Microsystems Packaging,Hong Kong University of Science and Technology

来源：

半导体学报 | 2011年 / 32卷 / 01期

关键词：

high power LED; thermal resistance network; finite element modeling;

D O I：

暂无

中图分类号：

TN312.8 [];

学科分类号：

0803 ;

摘要：

This paper provides an analytical approach to determine the optimum pitch by utilizing a thermal resistance network,under the assumption of constant luminous efficiency.This work allows an LED array design which is mounted on a printed circuit board(PCB) attached with a heat sink subject to the natural convection cooling. Being validated by finite element(FE) models,the current approach can be shown as an effective method for the determination of optimal component spacing in an LED array assembly for SSL.

引用

页码：45 / 49

页数：5