Microstructure formation and electrical resistivity behavior of rapidly solidified Cu-Fe-Zr immiscible alloys

被引:13
作者
Xiaojun Sun [1 ,2 ]
Jie He [1 ,2 ]
Bin Chen [1 ,2 ]
Lili Zhang [1 ]
Hongxiang Jiang [1 ]
Jiuzhou Zhao [1 ,2 ]
Hongri Hao [1 ]
机构
[1] Institute of Metal Research, Chinese Academy of Sciences
[2] School of Materials Science and Engineering, University of Science and Technology of China
基金
中国国家自然科学基金;
关键词
Immiscible alloys; Liquid-liquid phase separation; Rapid solidification; Microstructure; Electrical resistivity behavior;
D O I
暂无
中图分类号
TG156.3 [淬火、表面淬火]; TG146.11 [];
学科分类号
080201 ; 080502 ; 080503 ;
摘要
The immiscible Cu-Fe alloy was characterized by a metastable miscibility gap. With the addition element Zr, the miscibility gap can be extended into the Cu-Fe-Zr ternary system. The effect of the atomic ratio of Cu to Fe and Zr content on the behavior of liquid-liquid phase separation was studied. The results show that liquid-liquid phase separation into Cu-rich and Fe-rich liquids took place in the as-quenched Cu-Fe-Zr alloy. A glassy structure with nanoscale phase separation was obtained in the as-quenched(Cu0.5Fe0.5)40Zr60alloy sample, exhibiting a homogeneous distribution of glassy Cu-rich nanoparticles in glassy Fe-rich matrix. The microstructural evolution and the competitive mechanism of phase formation in the rapidly solidified Cu-Fe-Zr system were discussed in detail. Moreover, the electrical property of the as-quenched Cu-Fe-Zr alloy samples was examined. It displays an abnormal change of electrical resistivity upon temperature in the nanoscale-phase-separation metallic glass. The crystallization behavior of such metallic glass has been discussed.
引用
收藏
页码:201 / 208
页数:8
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