Thermal Stress Behavior of Diffusion-bonded SiC/6061Al Laminates during Thermal Cycling

被引：0
|
作者：
Huan LI
Jiabao LI and Zhongguang WANG(State Key Laboratory for Fatigue and Fracture of Materials
机构：
来源：
Journal of Materials Science & Technology | 1999年 / 02期
关键词：
Al; SiC;
D O I：
暂无
中图分类号：
TG111 [金属物理学];
学科分类号：
0702 ; 070205 ;
摘要：
The thermal stress behavior of bonded SiC/6061AL laminates during thermal cycling and the stress relaxation at elevated temperature (205℃) were investigated by means of X-ray diffraction.It was found that the elastic and elastoplastic deformation in the 6061Al layer took place during thermal cycling, and the same closed stress temperature loop was formed in the second cycling for the aged and low temperature treated specimen. Meanwhile, it was demonstrated that the compressive stress relaxed in 6061Al layer at 205℃ within the range of 0.5~16 h, and which was nearly unchanged with further prolongation of time.
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页码：117 / 120
页数：4
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