Reliability Analysis of Lithography Wafer Stage Based on Fuzzy Bayesian Networks

被引：0

作者：

韩晓萌

李彦锋

刘宇

黄洪钟

机构：

[1] SchoolofMechanicalElectronicandIndustrialEngineering,UniversityofElectronicScienceandTechnologyofChina

来源：

JournalofDonghuaUniversity(EnglishEdition) | 2014年 / 31卷 / 06期

关键词：

lithography; wafer stage; fuzzy Bayesian network(BN); reliability analysis;

D O I：

10.19884/j.1672-5220.2014.06.006

中图分类号：

TP18 [人工智能理论]; TN305.7 [光刻、掩膜];

学科分类号：

081104 ; 0812 ; 0835 ; 1405 ; 1401 ;

摘要：

Bayesian network( BN) is a powerful tool of uncertainty reasoning. Considering the insufficient information,incorporating fuzzy probability into BN is an effective method. Fuzzy BN was used to solve this problem. In this paper,fuzzy BN was applied in wafer stage system,which was an important part of lithography. BN of wafer stage was transferred from fault tree( FT). The quantitative assessment based on fuzzy BN was carried out. The Birnbaum importance factors of basic events were calculated. Therefore,the system failure probability and the vulnerable components could be gotten.

引用

页码：753 / 756

页数：4

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