共 10 条
[7]
Analysis on the difference of the characteristic between high power IGBT modules and press pack IGBTs[J] . Erping Deng,Zhibin Zhao,Qingming Xin,Jingwei Zhang,Yongzhang Huang.Microelectronics Reliability . 2017
[8]
Requirements in power cycling for precise lifetime estimation[J] . Christian Herold,J?rg Franke,Riteshkumar Bhojani,Andre Schleicher,Josef Lutz.Microelectronics Reliability . 2015
[9]
Failure criteria for long term Accelerated Power Cycling Test linked to electrical turn off SOA on IGBT module. A 4000 hours test on 1200A–3300V module with AlSiC base plate[J] . G. Coquery,R. Lallemand.Microelectronics Reliability . 2000 (8)
[10]
Using the Chip as a Temperature Sensor - The Influence of Steep Lateral Temperature Gradients on the V-CE(T)-Measurement .2 Ralf Schmidt,Uwe Scheuermann. EPE JOURNAL . 2011